Zobrazeno 1 - 10
of 82
pro vyhledávání: '"H.H. Kuo"'
Publikováno v:
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference. 2022
Quantitative biomarkers of infant motion may be predictive of the development of movement disorders. This study presents and validates a low cost, markerless motion tracking method for the estimation of upper body kinematics of infants from which pro
Autor:
D. Balta, H.H. Kuo, J. Wang, I.G. Porco, M.M. Schladen, A. Cereatti, P.S. Lum, U. Della Croce
Publikováno v:
Gait & Posture. 97:32-33
Publikováno v:
Carbon. 43:229-239
The effect of carbonization rate in a wide range (1, 100 and 1000 °C/min) on the properties of a PAN/phenolic-based carbon/carbon (C/C) composite was studied. The results indicated that the composite processed at a higher carbonization rate had a hi
Publikováno v:
Sensors and Actuators B: Chemical. 84:258-264
Al-doped ZnO films were deposited onto SiO 2 /Si substrates by rf magnetron sputtering system as a CO gas sensor. The dependence of the thin film thickness on CO gas sensing properties was investigated, where the film thickness was varied by controll
Publikováno v:
Materials Chemistry and Physics. 57:244-252
This work studied the braking (simulated-stop) behavior of a PAN-CVI-based carbon–carbon composite under different surface conditions. The results indicate that, under the same braking condition, the broken-in (BI) composite exhibited a higher fric
Publikováno v:
2006 International Interconnect Technology Conference.
The process integration of novel Cu CMP's barrier slurry for the 45nm-node non-capped ultra low-k (ULK, k < 2.5) technology is reported. The slurry, based on a 'self-stop' concept, was designed to mitigate the impact of ULK damage, such as unexpected
Publikováno v:
Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743).
A hybrid dual damascene interconnect approach with organic ultra-low-k for gap filling has been demonstrated. The traditional PR approach with via-first process for dual damascene suffers from ashing damage for CVD ultra-low-k. Our approach is able t
Autor:
T.C. Tseng, H.H. Kuo, J.Y. Song, Mong-Song Liang, S.M. Jang, K.C. Lin, S.N. Lee, Yen-Huei Chen, C.J. Chuang, W.C. Chiou
Publikováno v:
2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407).
Novel slurries were developed for Cu, TaN, and dielectric chemical mechanical polish (CMP) to greatly enhance the planarity of Cu dual damascene interconnect (DDI). Compared with conventional alumina-based slurries, the newly designed polymer-based s
Autor:
J.Y. Pan, Caleb Yu-Sheng Cho, Jung-Chang Lu, A. Hsu, Chi-Wei Hung, H.H. Kuo, Da Sung, C.L. Chen, Vincent Huang, P. Tuntasood, Der-Tsyr Fan, I.C. Chuang, Chi-Shan Wu, Cheng-Yuan Hsu, B. Sheen, C.C. Hsue, K. Tseng, S.C. Chen, Chiou-Feng Chen
Publikováno v:
Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004..
For the first time, split-gate NAND flash memory featuring interpoly erase and mid-channel programming is demonstrated at 120nm technology node. The cell array operates at single polarity voltages lower than 12V. Erase and programming can be accompli
Conference
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