Zobrazeno 1 - 10
of 299
pro vyhledávání: '"H.-J. Müssig"'
Autor:
P. Storck, H.-J. Müssig, Peter Zaumseil, Thomas Schroeder, Jarek Dabrowski, O. Seifarth, Alessandro Giussani
Publikováno v:
physica status solidi c. 6:653-662
Engineered Si wafer systems present an important materials science approach to further improve the performance of Si-based micro- and nanoelectronics. This is due to the potential to integrate alternative semiconductor layers on the mature Si wafer t
Autor:
Ioan Costina, H.-J. Müssig, Ch. Lohe, Mindaugas Lukosius, Ch. Wenger, R. Sorge, S. Pasko, J. Dabrowski
Publikováno v:
Microelectronic Engineering. 85:1762-1765
HfO"2 films were grown by atomic vapour deposition (AVD) on SiO"2/Si (100) substrates. The positive shift of the flat band voltage of the HfO"2 based metal-oxide-silicon (MOS) devices indicates the presence of negative fixed charges with a density of
Autor:
S. Pasko, R. Sorge, H.-J. Müssig, M. Lukosius, Ioan Costina, Christian Wenger, Jarek Dabrowski, Ch. Lohe
Publikováno v:
IEEE Transactions on Electron Devices. 55:2273-2277
Sr-Ta-O thin films were deposited as high-k dielectrics for metal-insulator-metal applications on 200-mm TiN/Si(100) substrates from a single-source Sr[Ta(OEt)5(methoxyethoxide)]2 precursor using atomic vapor deposition technique. The variation of pr
Autor:
S. Pasko, H.-J. Müssig, J. Dabrowski, M. Lukosius, Thomas Schroeder, Ioan Costina, R. Sorge, Ch. Lohe, Ch. Wenger
Publikováno v:
Microelectronic Engineering. 84:2165-2168
Sr"4Ta"2O"9 and HfO"2 films were prepared on 200 mm TiN/Si(100) substrates by Atomic Vapour Deposition (AVD). Depositions were carried out within a thermal budget of CMOS back end of line. Electrical properties have been investigated in metal-insulat
Autor:
Gunther Lippert, J. Dabrowski, Anil U. Mane, H.-J. Müssig, R. Sorge, Peter Zaumseil, Thomas Schroeder, G. Lupina, G. Weidner, Ch. Wenger
Publikováno v:
Microelectronic Engineering. 82:148-153
We present the process integration of the Pr-based high-k oxides Pr"2O"3, PrTi"xO"y and Pr"xSi"yO"z for CMOS devices. MOS structures were grown in form of p^+ poly-Si/Pr-based dielectric/Si(100) by MBE. RIE with CF"4/O"2 plasma was used to selectivel
Autor:
H.-J. Müssig, Dieter Schmeißer
Publikováno v:
Solid-State Electronics. 47:1607-1611
Pr2O3 is currently under consideration as a potential replacement for SiO2 as the gate-dielectric material for sub-0.1 μm complementary metal–oxide–semiconductor (CMOS) technology. We studied the Pr2O3/Si(0 0 1) interface by a non-destructive de
Publikováno v:
Surface Science. 504:159-166
Pr2O3 may be an alternative high-K gate dielectric material for silicon integrated circuits, i.e., it has a dielectric constant K P 25 and is currently under consideration as potential replacement for SiO2 as the gate dielectric material for sub-0.1
Publikováno v:
Journal of Crystal Growth. 235:229-234
We present the results for crystalline growth of praseodymium oxide on Si as a potential high- K dielectric with promising electrical properties. All layer growth experiments were performed using solid source molecular beam epitaxy. The initial stage
Publikováno v:
Materials Science and Engineering: B. 87:297-302
Praseodymium oxide is a potential high-K dielectric with promising electrical properties. Here, we present results for crystalline growth of praseodymium oxide on Si. On Si(001) surfaces, crystalline Pr2O3 grows as (110) domains, with two orthogonal
Publikováno v:
Solid-State Electronics. 45:1219-1231
We report the first direct observation of dissociative chemisorption of oxygen molecules on a silicon surface at room temperature via a molecular precursor state. We link this to the fact that smooth oxide layers can be grown easily on Si( 1 1 3 ). T