Zobrazeno 1 - 10
of 489
pro vyhledávání: '"H. Z. Han"'
Autor:
F. Y. Kong, H. Z. Han, S. X. Huang, Q. H. Teng, Y. Li, X. Q. Zhang, L. Zhu, K. Wang, F. P. Liang
Publikováno v:
Russian Journal of Coordination Chemistry. 48:667-674
Publikováno v:
Zhonghua er bi yan hou tou jing wai ke za zhi = Chinese journal of otorhinolaryngology head and neck surgery. 55(10)
耳蜗毛细胞是一种特殊的感觉上皮细胞,它接收机械声波并将其转化为神经信号传到神经中枢产生听觉。很多药物在临床使用过程中被发现有损伤内耳毛细胞的不良反应,其中氨基糖苷类抗
Publikováno v:
E3S Web of Conferences, Vol 275, p 02005 (2021)
This paper takes Yan’anas the study area, analyses the current situation of the policy, calculates the carbon sequestration value by using the afforestation area and woodland area in Yanan in 2019, and explores its carbon emission trading potential
Publikováno v:
Materials Research Innovations. 19:S2-96
This study is aimed at analysing the environmental impacts of environment-friendly clean briquette, being a new kind of briquette product, and compared with lignite by life-cycle assessment. The results based on inventory analysis and the assessment
Publikováno v:
Acta Horticulturae. :109-110
Autor:
X. Y. Zhang, Q. L. Wang, H. Z. Han, Yongxin Liu, Shu Wang, Yingjie Liu, Y. F. Wang, Yun Liu, Haijin Liu, Likun Jiang
Publikováno v:
Journal of Fish Biology. 82:588-599
A set of 72 microsatellite markers distributed evenly among 24 linkage groups were selected from the published genetic linkage maps of Japanese flounder Paralichthys olivaceus. In two normal diploid full-sib families, the test for Mendelian inheritan
Publikováno v:
Zhonghua jie he he hu xi za zhi = Zhonghua jiehe he huxi zazhi = Chinese journal of tuberculosis and respiratory diseases. 39(10)
Nickel electroforming with 355 nm UV laser process applied to 4G solidly mounted resonator packaging
Publikováno v:
2016 International Conference on Applied System Innovation (ICASI).
This study utilizes 355 nm ultraviolet (UV) laser' micro electroforming process with supercritical fluid to package 4G solidly mounted resonator (SMR) wafer. The diameter of drilling hole was 100–150 μm with the wafer thickness of 550 μm' and the
Publikováno v:
Bulletin of Materials Science. Dec2024, Vol. 47 Issue 4, p1-16. 16p.
Autor:
Parfenova, Lyudmila V.1 (AUTHOR) lollipiip@mail.ru, Galimshina, Zulfiya R.1 (AUTHOR), Parfenov, Evgeny V.2 (AUTHOR) evparfenov@mail.ru
Publikováno v:
International Journal of Molecular Sciences. Nov2024, Vol. 25 Issue 21, p11623. 37p.