Zobrazeno 1 - 10
of 138
pro vyhledávání: '"H. T. Hung"'
Publikováno v:
European Physical Journal C: Particles and Fields, Vol 82, Iss 8, Pp 1-22 (2022)
Abstract We show that the anomalous magnetic moment experimental data of muon and electron $$(g-2)_{\mu ,e}$$ ( g - 2 ) μ , e can be explained simultaneously in simple extensions of the 3-3-1 models consisting of new heavy neutrinos and a singly cha
Externí odkaz:
https://doaj.org/article/caf3a13430f844ce94e10fa26c0f0b52
Publikováno v:
The European Physical Journal C. 82
We show that the anomalous magnetic moment experimental data of muon and electron $(g-2)_{\mu,e}$ can be explained simultaneously in simple extensions of the 3-3-1 models consisting of new heavy neutrinos and a singly charged Higgs boson. The heavy n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::48d6288b756e114b1fb0b941b43107fe
https://doi.org/10.1140/epjc/s10052-022-10691-5
https://doi.org/10.1140/epjc/s10052-022-10691-5
Akademický článek
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Publikováno v:
Journal of Materials Research and Technology, Vol 9, Iss 6, Pp 12946-12954 (2020)
Metallurgical systems containing substantial amounts of metallic indium have always been very challenging to investigate due to the difficulties involved with sample characterization caused by the substantial softness of indium. Such difficulties are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5d25dbbd68c34f3e587cd6cf6c54561f
http://www.sciencedirect.com/science/article/pii/S2238785420317695
http://www.sciencedirect.com/science/article/pii/S2238785420317695
Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish
Publikováno v:
Journal of Electronic Materials. 49:5003-5008
Electroless Au is used to vertically connect copper pillars with electroless Ni immersion Au surface finish on two stacked chips by a microfluidic electroless interconnection process. A very low bonding temperature of 50°C and a pressure-less bondin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2cd70679ba1058fe7ca24cab5194e9b1
https://doi.org/10.1007/s11664-020-08245-0
https://doi.org/10.1007/s11664-020-08245-0
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:10161-10169
The Cu–In binary system is receiving increasing attention due to its application in the low-temperature assembly of heat-sensitive devices. Nevertheless, the fundamental behaviors of this binary system are very difficult to study because of the ext
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::055e94709c808f8a03cebcc73b5a6ea8
https://doi.org/10.1007/s10854-020-03561-x
https://doi.org/10.1007/s10854-020-03561-x
Publikováno v:
Chinese Physics C. 46:123104
In the framework of the 3-3-1 model with neutral leptons, we investigate lepton-flavor-violating sources based on the Higgs mass spectrum, which has two neutral Higgs identified with the corresponding ones of the two-Higgs-doublet model. We note that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4216b6ad61586fe9d1e22fc2945e7b4
https://doi.org/10.1088/1674-1137/ac88bb
https://doi.org/10.1088/1674-1137/ac88bb
Publikováno v:
Physical Review D. 104
We show that under current experimental bounds of the decays ${e}_{a}\ensuremath{\rightarrow}{e}_{b}\ensuremath{\gamma}$, the recent experimental data of the muon anomalous magnetic dipole moment $(g\ensuremath{-}2{)}_{\ensuremath{\mu}}$ can be expla
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c494b5013d5afa094abe4caa680e4b5
https://doi.org/10.1103/physrevd.104.033007
https://doi.org/10.1103/physrevd.104.033007
Publikováno v:
Microelectronics Reliability. 95:18-27
In this study, Cu/In/Cu sandwich structures were fabricated at 180 °C, which was followed by aging at 245 °C, 273 °C, and 290 °C for different time periods. The microstructural evolutions were investigated using scanning electron microscopy (SEM)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3168299f6c86765e9d1aeded415e01a
https://doi.org/10.1016/j.microrel.2019.02.004
https://doi.org/10.1016/j.microrel.2019.02.004
Publikováno v:
Scripta Materialia. 159:119-122
Self-assembled Au atoms were employed to bond vertical interconnection for chip-stacking applications without pressure and at a temperature of 50 °C. In this process, Au ions in an electroless plating solution are forced through a thin gap between S
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de07034ba665b4c4aeee7afd40f360cb
https://doi.org/10.1016/j.scriptamat.2018.09.026
https://doi.org/10.1016/j.scriptamat.2018.09.026