Zobrazeno 1 - 10
of 60
pro vyhledávání: '"H. Preu"'
Publikováno v:
Microsystem Technologies. 22:801-810
This paper is supposed to discuss the suitability to identify material parameters via nanoindentation of a viscoelastic dielectric thin film attached to a rigid substrate. In microelectronic components, polymer thin films used as packaging materials
Autor:
M. Hartung, Laurens Weiss, Duc-Khoi Vu, Bruno Michel, I. Maus, Bernhard Wunderle, H. Preu, C. Liebl, Kaspar M. B. Jansen, Markus Fink
Publikováno v:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particl
Publikováno v:
Microelectronics Reliability. 54:2023-2027
Exposing semiconductor devices with external capacitors to harsh environmental conditions may lead to electrical failures with the formation of conductive paths. This paper presents examples of the analysis of modules with the purpose to understand t
Publikováno v:
Delft University of Technology
During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die. These residual stresses add up to the stresses generated during thermal cycling a
Autor:
Manfred Mengel, H. Preu
Publikováno v:
International Journal of Adhesion and Adhesives. 27:330-337
In semiconductor industry the application of fast curing adhesives with curing times below 20 s is necessary for cost-effective production of electronic packages at high throughput. For the curing process control as well as for the selection of appro
Autor:
Matija Tomšič, Luc Belloni, H. Preu, Marija Bešter Rogač, Andrej Jamnik, Werner Kunz, Christine Schirmer
Publikováno v:
The Journal of Physical Chemistry B. 107:13862-13870
Ternary systems of dodecyltrimethylammonium bromide (C12TAB)/1-hexanol/water are examd. for series with const. surfactant/alc. molar ratios of 8:2, 8:4, 8:6, and 8:8 at surfactant concns. of 6.167-61.67 g/L (0.02-0.20 mol/L). The methods used are con
Autor:
I. Maus, Bruno Michel, Markus Fink, Kaspar M. B. Jansen, Bernhard Wunderle, Remi Pantou, H. Preu, M. Niessner
Publikováno v:
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Microelectronic devices integrate more and more diverse materials in order to miniaturize the packages. Epoxy resins enable smaller electronic devices with promising features [1]. The performance and the reliability of the product are highly dependen
Publikováno v:
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
We present an approach for the accurate prediction of the solder joint fatigue of quad flat packages (QFPs) with gullwing-shaped leads exposed to thermal cycling on board (TCoB). The derived fatigue life model is experimentally validated against more
Publikováno v:
Bioconjugate Chemistry. 12:883-889
A simple encapsulation technique is presented to produce highly phosphorescent, inert nanospheres that are suitable luminescent markers. It is based on the coprecipitation of phosphorescent ruthenium(II)-tris(polypyridyl) complexes and polyacrylonitr
Publikováno v:
Physical Chemistry Chemical Physics. 1:3321-3329
Small angle neutron scattering of direct micelles in binary surfactant–D2O and ternary surfactant–alcohol– D2O systems has been measured. The nonionic surfactant was poly(oxyethylene-23) lauryl ether (C12E23, commercial name: Brij 35) which was