Zobrazeno 1 - 10
of 541
pro vyhledávání: '"H. Olney"'
Autor:
Moore, Richard G.
Publikováno v:
The John Whitmer Historical Association Journal, 2013 Oct 01. 33(2), 58-78.
Externí odkaz:
https://www.jstor.org/stable/43200561
Autor:
L. Busque, M. Harnois, N. Szuber, R. Delage, L. Mollica, H. Olney, P. Laneuville, S. Sirhan, G. Cournoyer, I. Chamakhi, M. Lalancette, D. Talbot, V. Éthier, P. Desjardins, S. Assouline
Publikováno v:
HemaSphere, Vol 6, Pp 60-61 (2022)
Externí odkaz:
https://doaj.org/article/f047b85454dd44c5af37fc7d0c4324d3
Publikováno v:
Leukemia Research. 128:107277
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e41006e05dc8365f0fbc9fc0046a9aec
https://doi.org/10.1016/j.leukres.2023.107277
https://doi.org/10.1016/j.leukres.2023.107277
Publikováno v:
Microelectronics Reliability. 53:196-204
A new methodology for quantifying the effectiveness of CDM protection circuits and CDM robustness of I/O circuits is presented in this paper. This method, referred to as the vfTLP-V TH , consists of applying vfTLP stresses to test structures composed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7dd58943dcf8d9770afa9c2519e5fc60
https://doi.org/10.1016/j.microrel.2012.04.011
https://doi.org/10.1016/j.microrel.2012.04.011
Autor:
Kazemi-Sufi, Siamak1 (AUTHOR), Alipour, Shahriar2,3 (AUTHOR), Rabieepour, Masome4 (AUTHOR), Roshan-Milani, Shiva5,6 (AUTHOR), Naderi, Roya6,7 (AUTHOR) naderi.r@umsu.ac.ir
Publikováno v:
BMC Infectious Diseases. 9/27/2024, Vol. 24 Issue 1, p1-9. 9p.
Publikováno v:
Microelectronics Reliability. 45:287-295
ICs that are robust to ESD at the component-level may be damaged by ESD at the board-level. Two case studies show that real-world Charged Board Model (CBM) ESD damage is typically more severe than Human Body Model (HBM) or Charged Device Model (CDM)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c62bd9c11bc58934223e50e7279cee66
https://doi.org/10.1016/j.microrel.2004.05.016
https://doi.org/10.1016/j.microrel.2004.05.016
Publikováno v:
Leukemia Research. 39:S110-S111
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d0356ebf7844b10f9c9acf5784301af
https://doi.org/10.1016/s0145-2126(15)30222-8
https://doi.org/10.1016/s0145-2126(15)30222-8
Autor:
Andrew H. Olney
Publikováno v:
Microelectronics Reliability. 38:129-143
Of 30 bipolar, BiCMOS, and CMOS monolithic, integrated circuit products that were ESD classified to the socketed Charged Device Model (CDM), 27 had ≥500 V withstand voltages and experienced no real-world CDM failures. Two of the three focus product
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b75d9938e101a45fddd78805a89e3632
https://doi.org/10.1016/s0026-2714(97)00074-7
https://doi.org/10.1016/s0026-2714(97)00074-7
Publikováno v:
Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Physical failure observation is critical in determining the root-cause of ESD and EOS failures that may be due to circuit design weaknesses, product assembly shortcomings or electrical testing methodology issues. The insight gained from various physi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::772ba5c08781552445fc773bfd086636
https://doi.org/10.1109/ipfa.2013.6599128
https://doi.org/10.1109/ipfa.2013.6599128
Autor:
Andrew H. Olney
Publikováno v:
Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
The failure rates of electronic systems can be minimized if Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and Contract Manufacturers (CMs) follow specific guidelines for eliminating the most common causes of customer-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::701ec1cb64d1ad889de7ad0f1cf1c801
https://doi.org/10.1109/ipfa.2013.6599118
https://doi.org/10.1109/ipfa.2013.6599118