Výsledky vyhledávání - "H. M. Abd-Elmoniem"

Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy

Autor: A. M. El-Taher, H. M. Abd Elmoniem, S. Mosaad

Publikováno v: Journal of Materials Science: Materials in Electronics. 34

This study investigated the effects of cobalt microalloying addition on the microstructural features, thermal characteristics and mechanical behavior of eutectic Sn–0.7wt%Cu lead-free solder alloys. The results show that minor cobalt addition of ~

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::bf765b5c29573074b2b710158238e284
https://doi.org/10.1007/s10854-023-09967-7

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Robust effects of Bi doping on microstructure development and mechanical properties of hypoeutectic Sn–6.5Zn solder alloy

Autor: N. A. Mansour, A.A. El-Daly, H. M. Abd-Elmoniem, N. Radwan, E. H. Lotfy, Farid El-Tantawy, Hassan A. Hashem, T. R. Dalloul

Publikováno v: Journal of Materials Science: Materials in Electronics. 27:2950-2962

Sn–9Zn lead-free solders possess remarkable potential as candidates for low temperature electronic applications. In this study, it is proposed to utilize the advantages of Bi alloying and reducing the amount of Zn to improve oxidation resistance an

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::9d067d13d9d492b3578ba4c08597f5d6
https://doi.org/10.1007/s10854-015-4115-8

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