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pro vyhledávání: '"H. Louis Lo"'
Autor:
H. Louis Lo
Publikováno v:
ICCE
The accuracy of electrical models depend on the modeling method, the physical geometry for modeling, and model extraction tools. Due to the complex geometry of ultra-small consumer electrical device and the small signal integrity margin on low power
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b98bd5c7e0101e9a5e128b5692e95bff
https://doi.org/10.1109/icce.2019.8662108
https://doi.org/10.1109/icce.2019.8662108
Autor:
Bok Eng Cheah, H. Louis Lo
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
This paper investigates and discusses the impact of surface roughness on package insertion loss performance for high-speed applications up-to 50GHz. 3D electrical package with Hurray surface roughness modeling was established and simulated. The inser
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8cbf99d6578d9d37c50a628eb9f48b37
https://doi.org/10.1109/eptc.2015.7412292
https://doi.org/10.1109/eptc.2015.7412292
Publikováno v:
ICCE-TW
This paper evaluates the impact of dielectric loss tangent property on electrical insertion loss performance for both conventional and coreless packaging designs up-to 100Gbps datarate. Coreless package with metal grid array (MGA) second level interc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0131d8990e092a4bad4e8e919c8648b9
https://doi.org/10.1109/icce-tw.2015.7216818
https://doi.org/10.1109/icce-tw.2015.7216818
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