Zobrazeno 1 - 10
of 346
pro vyhledávání: '"H. Lightsey"'
Autor:
Li, Peng1 (AUTHOR) leeboom@tongji.edu.cn, Chen, Jiangyuan1 (AUTHOR), Duan, Zhitong1 (AUTHOR), Xu, Wei2 (AUTHOR), Feng, Yangcun1 (AUTHOR) fengyc@tongji.edu.cn
Publikováno v:
Behavioral Sciences (2076-328X). Dec2024, Vol. 14 Issue 12, p1191. 14p.
Autor:
Coluccio, Giuliani1 (AUTHOR) gcolucciop@academicos.uta.cl, Muñoz-Herrera, Sebastián2 (AUTHOR), Adriasola, Elisa3,4 (AUTHOR), Escobar, Elizabeth1 (AUTHOR)
Publikováno v:
Behavioral Sciences (2076-328X). Nov2024, Vol. 14 Issue 11, p1087. 16p.
Publikováno v:
American Journal of Speech-Language Pathology. Nov2024, Vol. 33 Issue 6, p2823-2838. 16p.
Publikováno v:
INCOSE International Symposium. 9:1343-1348
The open system approach is both a technical approach to systems engineering and a preferred business strategy that is becoming widely applied by commercial manufacturers of large complex systems. It has the attention of DoD management who have manda
Autor:
Nguyen-Viet, Bang1 (AUTHOR) bangnv@ueh.edu.vn, Nguyen, Phuc My1 (AUTHOR)
Publikováno v:
SAGE Open. Oct-Dec2024, Vol. 14 Issue 4, p1-15. 15p.
Publikováno v:
SAGE Open. Oct-Dec2024, Vol. 14 Issue 4, p1-14. 14p.
Autor:
Ju-Yeon Park1 juyeonpark@duksung.ac.kr, Haesung Im2 delightlord37@duksung.ac.kr, Sung-Ae Kim3 techsakim@duksung.ac.kr
Publikováno v:
Educational Technology & Society. Oct2024, Vol. 27 Issue 4, p53-68. 16p.
Autor:
Xu, Chen1 (AUTHOR), Li, Tingli2 (AUTHOR), Wei, Wei3 (AUTHOR), Wang, Liyuan4 (AUTHOR), Huang, Xianhui4 (AUTHOR), Jiang, Xue4 (AUTHOR), Xu, Song4 (AUTHOR)
Publikováno v:
Social Behavior & Personality: an international journal. Sep2024, Vol. 52 Issue 9, p1-11. 11p.
Autor:
Cherewick, Megan1,2 (AUTHOR) megan.cherewick@cuanschutz.edu, Cruz, Christina M.3,4 (AUTHOR), Giri, Priscilla5 (AUTHOR), Matergia, Michael2,6 (AUTHOR), Rai, Roshan P.5 (AUTHOR)
Publikováno v:
Brain & Behavior. Aug2024, Vol. 14 Issue 8, p1-8. 8p.
Publikováno v:
2008 58th Electronic Components and Technology Conference.
A novel fabrication process has been developed and characterized to create all-copper chip-to-substrate input/output (I/O) connections. Electroless copper plating followed by low temperature annealing in a nitrogen environment was used to create an a