Zobrazeno 1 - 10
of 283
pro vyhledávání: '"H. Kanber"'
Autor:
S.X. Bar, A. Kurdoghlian, W. Yau, Z. Bardai, M. Gawronski, C.S. Wu, H. Kanber, C. Pao, C. Seashore, M. Hu, D. Bosch
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 43:257-266
We have demonstrated very good performance, high yield Ka-band multifunctional MMIC results using our recently developed 0.25-/spl mu/m gate length pseudomorphic HEMT (PHEMT) manufacturing technology. Four types of MMIC transceiver components-low noi
Publikováno v:
Journal of Electronic Materials. 23:159-166
GaAs MESFET device structures have been grown on silicon nitride or silicon dioxide masked 50 and 76 mm GaAs substrates by low pressure organometallic vapor phase epitaxy. Very smooth, featureless morphology and 100 percent selectivity of GaAs island
Publikováno v:
Journal of Electronic Materials. 19:1265-1271
We studied silver barrier ohmic (Ni/AuGe/Ag/Au) contacts to the GaAs based HEMT structures and observed strong dependence of the cleaning procedures on the ohmic con-tact resistance (Rc), its stability and reliability. The chemical profiles of the me
Publikováno v:
Proceedings of the 7th Conference on Semi-insulating III-V Materials.
There is a growing need for rapid non-destructive mapping of defects and polishing damage in semi-insulating GaAs wafers used in the efficient manufacture of microwave and millimeter wave monolithic integrated circuits (MMICs). Optical mapping by spa
Publikováno v:
11th Annual Gallium Arsenide Integrated Circuit (GaAs IC) Symposium.
An approach to fabricating X-band power FETs by direct implantation into MBE-grown GaAs/Si incorporating low-temperature buffer layers is described. Devices fabricated on GaAs-on-Si wafers were compared directly to GaAs ion-implanted FET wafers that
Publikováno v:
15th Annual GaAs IC Symposium.
The authors present an approach to establishing PHEMT manufacturing technology. They discuss the impact of development work in four key process areas. They also demonstrate good wafer uniformity and wafer to wafer reproducibility for PHEMT X-band mul
Autor:
H. Kanber, B.M. Paine, S. Janesch, C.S. Wu, S.X. Bar, D. Kaputa, W. Yau, W. Fabian, Z. Bardai
Publikováno v:
1994 IEEE MTT-S International Microwave Symposium Digest (Cat. No.94CH3389-4).
Design translation is demonstrated at X-Band utilizing a multifunction MMIC as a test vehicle. The MMIC circuit consisting of a switch, LNA and attenuator is fabricated using PHEMT materials at two different GaAs foundries (Hughes and Martin Marietta
Autor:
محمدرضا خسروی فارسانی1, الهام رئیسی2 ElhamRaeisi@gmail.com, فاطمه حاجی ولی زاده3, محبوبه درمان4, حدیث قجری3
Publikováno v:
Paramedical Sciences & Military Health. 2024, Vol. 18 Issue 3, p1-9. 9p.
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 8:297
GaAs has been grown by molecular‐beam epitaxy on both silicon and silicon on sapphire. The incorporation of a low temperature buffer has reduced the film stress from 3.0 to 2.2 kbar for GaAs grown on silicon. However, films stress can be completely
Autor:
Kallis, Karoline, Conlin, Christopher C., Ollison, Courtney, Hahn, Michael E., Rakow‐Penner, Rebecca, Dale, Anders M., Seibert, Tyler M.
Publikováno v:
Journal of Applied Clinical Medical Physics; Nov2024, Vol. 25 Issue 11, p1-9, 9p