Zobrazeno 1 - 10
of 15
pro vyhledávání: '"H. J. van de Wiel"'
Autor:
H. J. van de Wiel, M. M. Stuiver, A. M. May, S. van Grinsven, N. K. Aaronson, V. P. Retèl, H. S. A. Oldenburg, H. G. van der Poel, S. Horenblas, W. H. van Harten, W. G. Groen
Publikováno v:
BMC Cancer, Vol 18, Iss 1, Pp 1-13 (2018)
Abstract Background Higher levels of physical activity (PA) after treatment are associated with beneficial effects on physical and psychosocial functioning of cancer survivors. However, survivors often do not meet the recommended levels of PA. In ord
Externí odkaz:
https://doaj.org/article/e0ea453a865d4520812863bdc6349cc1
Autor:
Valesca P. Retèl, W.H. van Harten, H. J. van de Wiel, Martijn M. Stuiver, Neil K. Aaronson, A M May, Hester S. A. Oldenburg, H.G. van der Poel, S. van Grinsven, Simone N. Koole, Wim G. Groen
Publikováno v:
Cancers, Vol 13, Iss 3665, p 3665 (2021)
Cancers, 13(15):3665. Multidisciplinary Digital Publishing Institute (MDPI)
Cancers
van de Wiel, H J, Stuiver, M M, May, A M, van Grinsven, S, Aaronson, N K, Oldenburg, H S A, van der Poel, H G, Koole, S N, Retèl, V P, van Harten, W H & Groen, W G 2021, ' Effects of and lessons learned from an internet-based physical activity support program (With and without physiotherapist telephone counselling) on physical activity levels of breast and prostate cancer survivors : The PABLO Randomized Controlled Trial ', Cancers, vol. 13, no. 15, 3665 . https://doi.org/10.3390/cancers13153665
Volume 13
Issue 15
Cancers, 13(15):3665. Multidisciplinary Digital Publishing Institute (MDPI)
Cancers
van de Wiel, H J, Stuiver, M M, May, A M, van Grinsven, S, Aaronson, N K, Oldenburg, H S A, van der Poel, H G, Koole, S N, Retèl, V P, van Harten, W H & Groen, W G 2021, ' Effects of and lessons learned from an internet-based physical activity support program (With and without physiotherapist telephone counselling) on physical activity levels of breast and prostate cancer survivors : The PABLO Randomized Controlled Trial ', Cancers, vol. 13, no. 15, 3665 . https://doi.org/10.3390/cancers13153665
Volume 13
Issue 15
Simple Summary Many cancer survivors have difficulties in attaining and maintaining physical activity (PA) after treatment. Therefore, we developed an Internet-based PA support program (IPAS), embedded in a patient portal. The aim of this study is to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::196568cc29a8d6391fcfa6be3f39f2a1
https://www.mdpi.com/2072-6694/13/15/3665
https://www.mdpi.com/2072-6694/13/15/3665
Autor:
Hester S. A. Oldenburg, Wim G. Groen, H. J. van de Wiel, Martijn M. Stuiver, H.G. van der Poel, Anne Maria May, Neil K. Aaronson, Simon Horenblas, W.H. van Harten, S. van Grinsven, Valesca P. Retèl
Publikováno v:
van de Wiel, H J, Stuiver, M M, May, A M, van Grinsven, S, Aaronson, N K, Retèl, V P, Oldenburg, H S A, van der Poel, H G, Horenblas, S & van Harten, W H 2018, ' (Cost-)effectiveness of an internet-based physical activity support program (with and without physiotherapy counselling) on physical activity levels of breast and prostate cancer survivors : design of the PABLO trial ', BMC Cancer, vol. 18, no. 1, pp. 1073 . https://doi.org/10.1186/s12885-018-4927-z
BMC Cancer, 18(1). BioMed Central
BMC Cancer, Vol 18, Iss 1, Pp 1-13 (2018)
BMC Cancer, 18:1073. BioMed Central
BMC Cancer
BMC Cancer, 18(1). BioMed Central
BMC Cancer, Vol 18, Iss 1, Pp 1-13 (2018)
BMC Cancer, 18:1073. BioMed Central
BMC Cancer
Background Higher levels of physical activity (PA) after treatment are associated with beneficial effects on physical and psychosocial functioning of cancer survivors. However, survivors often do not meet the recommended levels of PA. In order to pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d8473213a0bf57442138318370537fd5
https://doi.org/10.1186/s12885-018-4927-z
https://doi.org/10.1186/s12885-018-4927-z
Publikováno v:
Microsystem Technologies. 20:653-662
Wafer-level Cu-Sn intermetallic bonding is an interesting process for advanced applications in the area of MEMS and 3D interconnects. The existence of two intermetallic phases for Cu-Sn system makes the wafer bonding process challenging. The impact o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3616cc397d6bccd71ee0fc928ac6a44
https://doi.org/10.1007/s00542-013-2002-x
https://doi.org/10.1007/s00542-013-2002-x
Autor:
Adriana Lapadatu, Knut E. Aasmundtveit, Greg R. Hayes, H. J. van de Wiel, Astrid-Sofie B. Vardoy, Stian Martinsen, Maaike M. Visser Taklo, Hartmut R. Fischer
Publikováno v:
International Symposium on Microelectronics. 2013:000717-000722
Hermetic wafer-level Cu-Sn solid-liquid interdiffusion (SLID) bonding was investigated to explore the sensitivity of selected process parameters with regard to voiding and possible reduction of strength. Little or no variation was observed in the voi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3975b974aa40ce4bb1f793828ef52be9
https://doi.org/10.4071/isom-2013-wp44
https://doi.org/10.4071/isom-2013-wp44
Autor:
Jeroen Schram, J. Van Den Brand, H J van de Wiel, Ashok Sridhar, Maarten Cauwe, Roel Kusters, D. A. van den Ende
Publikováno v:
Microelectronics Reliability, 12, 54, 2860-2870
Ultra-thin chips of less than 20 μm become flexible, allowing integration of silicon IC technology with highly flexible electronics such as food packaging sensor systems or healthcare and sport monitoring tags as wearable patches or even directly in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::987f4290f011cb2f0ddd0ae8ecf07708
http://resolver.tudelft.nl/uuid:d615f276-d513-431e-a970-89d0c09175ef
http://resolver.tudelft.nl/uuid:d615f276-d513-431e-a970-89d0c09175ef
Publikováno v:
Conference Smart Sensors, Actuators, and MEMS VI, 24-26 April 2013, Grenoble, France, 8763
The impact of process parameters on final bonding layer quality was investigated for Transient Liquid Phase (TLP) wafer-level bonding based on the Cu-Sn system. Subjects of this investigation were bonding temperature profile, bonding time and contact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d2a259ec374feb3e79c9f969fef99a4d
https://doi.org/10.1117/12.2017350
https://doi.org/10.1117/12.2017350
Autor:
M G M Nagelkerke, R H C A T Lelieveld, T J van Lammeren, Wilhelm A. Groen, H J van de Wiel, Santhosh Shanmugam, J F J de Riet, D Hui, Yulia Galagan, Jan Gilot, Ashish Kumar Pagudala
Publikováno v:
Nanotechnology, 48, 24
Highly conductive screen printed metallic (silver) structures (current collecting grids) combined with poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) are a viable replacement for indium tin oxide (ITO) and inkjet printed silver
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6e465944fdfd38fc106be78b6a0f9298
http://resolver.tudelft.nl/uuid:95346998-c362-420c-b599-9f68d2064da8
http://resolver.tudelft.nl/uuid:95346998-c362-420c-b599-9f68d2064da8
Autor:
V. Simons, Adri van der Waal, Stian Martinsen, Maaike M. Visser Taklo, Ingrid De Wolf, Adriana Lapadatu, Bernhard Wunderle, Astrid-Sofie B. Vardoy, H. J. van de Wiel
Publikováno v:
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, 16 July 2013 through 18 July 2013, Burlingame, CA
The level of stress in silicon as a result of applying Cu-Sn SLID wafer level bonding to hermetically encapsulate a highperformance infrared bolometer device was studied. Transistors are present in the read out integrated circuit (ROIC) of the device
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3d9b2d72d97d7747172db861a78338c8
http://resolver.tudelft.nl/uuid:bfe70d7a-239d-4ab9-8de8-26cae1237a7a
http://resolver.tudelft.nl/uuid:bfe70d7a-239d-4ab9-8de8-26cae1237a7a
Autor:
G. R. Hayes, H. J. van de Wiel, Adriana Lapadatu, Maaike M. Visser Taklo, A-S. B. Vardoy, H. R. Fischer
Publikováno v:
2012 4th Electronic System-Integration Technology Conference, ESTC 2012, 17 September 2012 through 20 September 2012, Amsterdam
A flux-less copper-tin (Cu-Sn) solid-liquid inter-diffusion (SLID) bonding process, providing a cost-effective hermetic vacuum sealing at wafer-level, has been investigated. Observations have been made indicating that the storage time of Cu-Sn plated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5d4d43f97f52822f62724fc082863c57
http://resolver.tudelft.nl/uuid:c39489b4-b95a-4445-8ad4-6f54e89b6976
http://resolver.tudelft.nl/uuid:c39489b4-b95a-4445-8ad4-6f54e89b6976