Zobrazeno 1 - 10
of 81
pro vyhledávání: '"H. J. L. Bressers"'
Autor:
H. J. L. Bressers, Daoguo Yang, L.J. Ernst, L. Goumans, J.H.J. Janssen, D. Y. Gui, K.M.B. Jansen
Publikováno v:
Journal of Applied Polymer Science. 109:2016-2022
Received 27 December 2005; accepted 5 December 2007DOI 10.1002/app.28317Published online 6 May 2008 in Wiley InterScience (www.interscience.wiley.com).ABSTRACT: Molding temperature, molding pressure,and time are three major parameters affecting the c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::527d98a0ec6c0cd848405df412007e22
https://doi.org/10.1002/app.28317
https://doi.org/10.1002/app.28317
Publikováno v:
Microelectronics Reliability. 47:290-294
Among various materials, polymers are widely used in microelectronics as different product constituents, such as encapsulants, conductive or non-conductive adhesives, underfills, molding compounds, insulators, dielectrics, and coatings. The behavior
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6eb6dc13954e7ad11f6449da6caf92ab
https://doi.org/10.1016/j.microrel.2006.09.035
https://doi.org/10.1016/j.microrel.2006.09.035
Autor:
H. J. L. Bressers, Xuejun Fan, W.D. van Driel, M. van Gils, G.Q. Zhang, J.H.J. Janssen, R.B.R. van Silfhout
Publikováno v:
Microelectronics Reliability. 47:273-279
This paper presents a combined numerical and experimental methodology for predicting and preventing moisture induced failures in encapsulated packages. Prevention of such failures will enable efficient and optimal pre-selection of materials, their in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16e9e4a25377cc88ebbe1bf99e9fe9f5
https://doi.org/10.1016/j.microrel.2006.09.011
https://doi.org/10.1016/j.microrel.2006.09.011
Autor:
Kaspar M. B. Jansen, Guoqi Zhang, C. van't Hof, Daoguo Yang, G. Wisse, H. J. L. Bressers, L.J. Ernst
Publikováno v:
Microelectronics Reliability. 47:240-247
In order to calculate cure induced stresses, reliable material data is needed over a large modulus range. This paper concerns the derivation of correction equations needed for the interpretation of dynamic mechanical experiments on two different shea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3941dd218989139874703e09b5887898
https://doi.org/10.1016/j.microrel.2006.09.032
https://doi.org/10.1016/j.microrel.2006.09.032
Autor:
L.J. Ernst, H. J. L. Bressers, Kaspar M. B. Jansen, W.D. van Driel, J.H.J. Janssen, Daoguo Yang, Guoqi Zhang
Publikováno v:
Microelectronics Reliability. 47:310-318
Warpage is a critical issue for QFN array molding process. In this paper, a cure-dependent viscoelastic constitutive model is established to model the cure-induced warpage in array molding process. For the relaxation modulus functions of the packagin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::925c8852565d82c1d10105da4105689b
https://doi.org/10.1016/j.microrel.2006.09.036
https://doi.org/10.1016/j.microrel.2006.09.036
Publikováno v:
Microelectronics Reliability. 47:233-239
In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. Du
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::075909a7cc7b6ea293165c794dee284e
https://doi.org/10.1016/j.microrel.2006.09.031
https://doi.org/10.1016/j.microrel.2006.09.031
Publikováno v:
Journal of Electronic Packaging. 125:539-548
For reliable virtual thermo-mechanical prototyping of electronic packages appropriate descriptions of the mechanical behavior of the constituent materials are essential. In many packages molding compounds are used for encapsulation and underfill to p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49f78f5a7f50b1a8af886888d676f318
https://doi.org/10.1115/1.1604156
https://doi.org/10.1115/1.1604156
Autor:
L.J. Ernst, Guoqi Zhang, Daoguo Yang, J.H.J. Janssen, C. van 't Hof, H. J. L. Bressers, Kaspar M. B. Jansen
Publikováno v:
Micro-and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ISBN: 9780387279749
In computational prototyping of electronic packages an appropriate description of the mechanical behavior of polymers being included is required. An overview of presently available material models is presented. In particular a cure dependent linear-v
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::deb8406b223ac2ec3e90e4c3af4ad594
https://doi.org/10.1007/0-387-32989-7_1
https://doi.org/10.1007/0-387-32989-7_1
Autor:
L.J. Ernst, C. van 't Hof, Guoqi Zhang, M. Saraswat, Daoguo Yang, H. J. L. Bressers, Kaspar M. B. Jansen
Publikováno v:
2006 7th International Conference on Electronic Packaging Technology.
In order to establish the possible influence of residual stress-and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31d46dbb8c2c30134d6ae09807305640
https://doi.org/10.1109/icept.2006.359808
https://doi.org/10.1109/icept.2006.359808
Publikováno v:
7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
The present state-of-the-art in simulation of stresses in electronic packages is to model the moudling compound as a viscoelastic material. That means that stresses during packaging and subsequent thermomechanical loading are allowed to relax partial
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1964ec205354a9916c57195987bfc0ef
https://doi.org/10.1109/esime.2006.1644066
https://doi.org/10.1109/esime.2006.1644066