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pro vyhledávání: '"H. J. Geipel"'
Autor:
W. K. Tice, H. J. Geipel
Publikováno v:
IBM Journal of Research and Development. 24:310-317
Damage introduced by ion implantation on the back side of the wafer is used to reduce the MOS transient (relaxation) and junction leakage; the technique is applied to dynamic memory cells. Conditions necessary to ensure efficient gettering by various
Autor:
H. J. Geipel, R. B. Shasteen
Publikováno v:
IBM Journal of Research and Development. 24:362-369
Shallow (
Publikováno v:
Journal of The Electrochemical Society. 129:1330-1335
Publikováno v:
Journal of The Electrochemical Society. 129:1307-1312
Autor:
H. J. Geipel, W. K. Tice
Publikováno v:
Applied Physics Letters. 30:325-327
The nature of residual ion‐implantation damage responsible for gettering deleterious impurities from active semiconductor device regions in Si has been studied. A propensity for dislocations of the type b=1/2 〈110〉 to gather metallic contaminan
Autor:
H J, Geipel
Publikováno v:
Quintessence international. 1(8)
Autor:
H J, Geipel
Publikováno v:
Die Quintessenz. 19(7)