Zobrazeno 1 - 2
of 2
pro vyhledávání: '"H. J. Dohse"'
Publikováno v:
Microelectronic Engineering. 30:567-570
A scanning electron-beam wafer inspection system (SEMSpec) has been developed. This system uses a high current (30–50 nA) field emission source to produce a low energy (800 eV) inspection beam. High speed digital processing (108 pixels/sec) of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0c71effde4e75a1f71654d0a2871521
https://doi.org/10.1016/0167-9317(95)00311-8
https://doi.org/10.1016/0167-9317(95)00311-8
Autor:
C.‐S. Pan, M. Robinson, D. J. Clark, J. Taylor, Alan D. Brodie, H. J. Dohse, L. S. Chuu, R. E. Paul, D. G. Emge, D. E. A. Smith, B. G. Becker, J. E. McMurtry, Lee H. Veneklasen, J. K. H. Rough, J. D. Greene, A. A. Desai, C. H. Chadwick, W. D. Meisburger, Jau Jack Y, M. Y. Ling, R. R. Simmons, P. A. Wieczorek, S. C. Wong, L. A. Honfi, P. Sandland, Zhongwei Chen, A. Dutta, S. G. Lele
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 9:3005
SEMSpec is a scanning electron‐beam inspection system designed for high‐resolution die‐to‐die inspections of conductive x‐ray masks, wafer prints, or stencil masks in a production environment. The inspection sensitivity can be varied from 9
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d2aef77a750cc49df0ba34626d927b2
https://doi.org/10.1116/1.585358
https://doi.org/10.1116/1.585358