Zobrazeno 1 - 10
of 123
pro vyhledávání: '"H. Gloor"'
Autor:
Jürg Schläpfer, Christian Sticherling, U Bauersfeld, Juerg Fuhrer, Haran Burri, P Zwicky, I Babotai, H Gloor
Publikováno v:
Cardiovascular Medicine. 14:86-91
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f233c3865862b0483172de0398c57d26
https://doi.org/10.4414/cvm.2011.01575
https://doi.org/10.4414/cvm.2011.01575
Autor:
Jürg Schläpfer, Christian Sticherling, I Babotai, U Bauersfeld, Haran Burri, H Gloor, P Zwicky, Juerg Fuhrer
Publikováno v:
Cardiovascular Medicine. 14:61-66
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6a376ffad7837fc75071e11ec6b354b
https://doi.org/10.4414/cvm.2011.01568
https://doi.org/10.4414/cvm.2011.01568
Autor:
H Gloor, U Bauersfeld, Jürg Schläpfer, Christian Sticherling, I Babotai, P Zwicky, Haran Burri, Juerg Fuhrer
Publikováno v:
Cardiovascular Medicine. 14:20-23
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f067f269e5c6a664bee9461d10b3f8b
https://doi.org/10.4414/cvm.2011.01560
https://doi.org/10.4414/cvm.2011.01560
Autor:
H Gloor, Juerg Fuhrer, U Bauersfeld, Jürg Schläpfer, P Zwicky, Christian Sticherling, Haran Burri, I Babotai
Publikováno v:
Cardiovascular Medicine. 14:16-19
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::355b4e180c38fa40b931bf133487ce4c
https://doi.org/10.4414/cvm.2011.01562
https://doi.org/10.4414/cvm.2011.01562
Autor:
Oswin Ehrmann, J. Wolf, Se-Young Jang, Herbert Reichl, H. Gloor, T. Schreiber, Kyung-Wook Paik
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 26:245-254
The electroplating solder bumping process offers fine pitch, high reliability, and cost effective advantages for flip-chip technology. In this technology, under bump metallization (UBM) is required for chemical solder deposition and mechanically reli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7360eca07ad0f08640cd8f02d86cd885
https://doi.org/10.1109/tcapt.2002.807591
https://doi.org/10.1109/tcapt.2002.807591
Autor:
P Zwicky, H Gloor, Haran Burri, U Bauersfeld, Juerg Fuhrer, I Babotai, Jürg Schläpfer, Christian Sticherling
Publikováno v:
Cardiovascular Medicine. 14:58-60
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24a0df966628a4586f923f6ccc6e2823
https://doi.org/10.4414/cvm.2011.01569
https://doi.org/10.4414/cvm.2011.01569
Autor:
Jürg Schläpfer, Christian Sticherling, Juerg Fuhrer, Haran Burri, H Gloor, U Bauersfeld, I Babotai, P Zwicky
Publikováno v:
Cardiovascular Medicine. 14:13-15
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f6ebe03b4bb1b243b754f925a4bf6320
https://doi.org/10.4414/cvm.2011.01559
https://doi.org/10.4414/cvm.2011.01559
Autor:
H, GLOOR
Publikováno v:
Archiv der Julius Klaus-Stiftung fur Vererbungsforschung, Sozialanthropologie und Rassenhygiene. 21(3-4)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::0aad09b2295d4f207c95f3d3db9e8282
https://pubmed.ncbi.nlm.nih.gov/20245966
https://pubmed.ncbi.nlm.nih.gov/20245966
Autor:
H, GLOOR
Publikováno v:
Archiv der Julius Klaus-Stiftung fur Vererbungsforschung, Sozialanthropologie und Rassenhygiene. 20
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::6dc803f0b8f74d294d9a1c9383732ee0
https://pubmed.ncbi.nlm.nih.gov/20276269
https://pubmed.ncbi.nlm.nih.gov/20276269
Pb-free solder is one of the biggest issues in today's electronic packaging industry. This paper introduces a newly developed Sn/3.5Ag alloy plating process for wafer level bumping. The effects of Under Bump Metallization (UBM) on the process, interf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::23b4ac0fc730b8da0d8552c5e3dd10bd
https://publica.fraunhofer.de/handle/publica/203045
https://publica.fraunhofer.de/handle/publica/203045
