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Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Jul 2020, Cracow, Poland. pp.1-7, ⟨10.1109/EuroSimE48426.2020.9152652⟩
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Jul 2020, Cracow, Poland. pp.1-7, ⟨10.1109/EuroSimE48426.2020.9152652⟩
The manufacturing process causes silicon wafer curvature because of the thermomechanical mismatch between each layers and the substrate. This curvature depends on many factors such as the properties of the used materials (Young’s modulus, Poisson
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f54cd394fa97f50322d364d1c911e379
https://hal.archives-ouvertes.fr/hal-02972476
https://hal.archives-ouvertes.fr/hal-02972476
