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Publikováno v:
Archive of Applied Mechanics. 74:728-738
In what follows we determine the mechanical properties of intermetallic phases in microelectronic structures with the help of nanoindentation. Additionally, we try to answer the question of whether nanoindentation can be used to quantify the growth o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e98da240976b456e32741b6728affe9
https://doi.org/10.1007/s00419-005-0394-5
https://doi.org/10.1007/s00419-005-0394-5
Autor:
Joerg Strogies, H.-J. Albrecht
Publikováno v:
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28080f266fe60e48a42143af2056cad9
https://doi.org/10.1109/estc.2014.6962758
https://doi.org/10.1109/estc.2014.6962758
Autor:
J. Gamalski, H.‐J. Albrecht
Publikováno v:
Microelectronics International. 14:21-30
To meet the state‐of‐the‐art requirements of BGA assemblies necessitates direct coupling of field conditions, simulation tools for life‐time study and advanced experiments for the assessment of physical degradation. For conventionally soldere
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2df2a6bcb6ffdf8031dac35fb4439e8f
https://doi.org/10.1108/13565369710800565
https://doi.org/10.1108/13565369710800565
Publikováno v:
Aktuelle Rheumatologie. 18:99-103
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02197859abae187045fa8cbecb33c87f
https://doi.org/10.1055/s-2008-1047321
https://doi.org/10.1055/s-2008-1047321
Publikováno v:
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
A study of the performance of different Sn based solder alloys applied for large to small sized solder interconnects was undertaken. From the theoretical and experimental investigations on creep, fatigue and brittle fracture behaviors the paper focus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd524bc66586fb47631843f3696bd3a4
https://doi.org/10.1109/itherm.2008.4544332
https://doi.org/10.1109/itherm.2008.4544332
Publikováno v:
2006 1st Electronic Systemintegration Technology Conference.
This paper focuses on a finite element analysis of the state of stress and strain within an intermetallic layer at the interface of a lead-free solder joint. The magnitude and sign of the stresses and strains (tensile vs. compressive) is discussed as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90bd3713f23d2f401a48ebe373440563
https://doi.org/10.1109/estc.2006.280061
https://doi.org/10.1109/estc.2006.280061
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
We investigate the mechanical properties of intermetallic phases in microelectronic structures with the help of nanoindentation. Moreover, we shall try to answer the question as to whether nanoindentation can be used to quantify the growth of interme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7498f8255dbed216ca2d8f0ce7dda52c
https://doi.org/10.1109/eptc.2004.1396652
https://doi.org/10.1109/eptc.2004.1396652
Autor:
A. Vogliano, A. Juritza, J. Villain, H.-J. Albrecht, K. Muller, Jens Sterthaus, Wolfgang H. Müller
Publikováno v:
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
In this paper we present our results on how nanoindentation can serve for measurement of (local) mechanical properties in microelectronic materials and components. Special attention is paid to the properties of interface regions, i.e., the region of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9e19c6a86f177a3207d654d968df985
https://doi.org/10.1109/eptc.2003.1271613
https://doi.org/10.1109/eptc.2003.1271613
Publikováno v:
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
This paper presents lifetime predictions, based on finite element analysis (FEA), for the copper via connectors present in high density interconnectors (HDI) used for mounting of CSPs. The life-saving impact of various fillings of these connectors is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0b0ac2da4af6eaafb87fe0cdb579dcd
https://doi.org/10.1109/eptc.2000.906409
https://doi.org/10.1109/eptc.2000.906409