Zobrazeno 1 - 10
of 776
pro vyhledávání: '"H, Reichl"'
Autor:
Peng Liu, Miranda N. Reed, Linda A. Kotilinek, Marianne K.O. Grant, Colleen L. Forster, Wei Qiang, Samantha L. Shapiro, John H. Reichl, Angie C.A. Chiang, Joanna L. Jankowsky, Carrie M. Wilmot, James P. Cleary, Kathleen R. Zahs, Karen H. Ashe
Publikováno v:
Cell Reports, Vol 11, Iss 11, Pp 1760-1771 (2015)
The accumulation of amyloid-β (Aβ) as amyloid fibrils and toxic oligomers is an important step in the development of Alzheimer’s disease (AD). However, there are numerous potentially toxic oligomers and little is known about their neurological ef
Externí odkaz:
https://doaj.org/article/ed7d1c4523f74c97baa11c1bae853b85
Autor:
Karen H. Ashe, Peng Liu, David R. Borchelt, Colleen L. Forster, Eshaan R. Rao, Eric S. Huang, Brittany M. McNellis, Robert Vassar, Michael A. Kuskowski, Kathleen R. Zahs, John H. Reichl, Laura S Hemmy
Publikováno v:
Journal of Alzheimer's Disease. 56:743-761
There exist several dozen lines of transgenic mice that express human amyloid-β protein precursor (AβPP) with Alzheimer's disease (AD)-linked mutations. AβPP transgenic mouse lines differ in the types and amounts of Aβ that they generate and in t
Autor:
T. Schöller, Michaela Hladik, Elisabeth Russe, H. Reichl, Florian Ensat, H. Hussl, P. Pülzl, Gottfried Wechselberger
Publikováno v:
Der Chirurg. 86:476-481
Hintergrund Die autologe Fettgewebstransplantation, auch als Lipofilling bezeichnet, besitzt als korpereigenes Gewebe die Eigenschaften eines idealen Fillers. Sie wird in der rekonstruktiven und asthetischen Chirurgie zur Korrektur angeborener oder e
Autor:
Lorenz Larcher, Michaela Hladik, H. Schubert, Florian Ensat, H. Reichl, Gottfried Wechselberger
Publikováno v:
Operative Orthopädie und Traumatologie. 25:176-184
Deckung von Weichteildefekten mit freiliegendem Knochen, Sehnen oder Osteosynthesematerial an der oberen und unteren Extremitat und im Kopf-Hals-Bereich durch Transplantation einer freien, mikrovaskular angeschlossenen Lappenplastik. Weichteildefekte
Autor:
H. Reichl, J. Römisch, A. Neisser-Svae, L. Gregori, A. Heger, T.-E. Svae, S. Jordan, A. Bailey, M. Behizad
Publikováno v:
Vox Sanguinis. 97:226-233
BACKGROUND AND OBJECTIVES A new chromatographic step for the selective binding of abnormal prion protein (PrP(Sc)) was developed, and optimization for PrP(Sc) capture was achieved by binding to an affinity ligand attached to synthetic resin particles
Autor:
R. Sinning, K.-F. Becker, Martin Schneider-Ramelow, R. Schacht, Hans Walter, Bruno Michel, K. Halser, O. Wittler, N. Simper, Bernhard Wunderle, H. Reichl
Publikováno v:
Microsystem Technologies. 15:1467-1478
In this paper we examine the thermo-mechanical reliability of polymer-encapsulated chip-on-board (COB) assemblies for power applications by simulation and experiment. Thereby the focus is set on the low cycle fatigue failure behaviour of the die-atta
Publikováno v:
Journal of Materials Science: Materials in Electronics. 19:563-568
The uniformity and deformation of electrochemical deposition (ECD) bumps get more and more important with the pitch shrinking and density increasing according to the requirement of modern electronic industry. In this paper, wafer level diameter and t
Autor:
Kathleen R. Zahs, Robert Vassar, Colleen L. Forster, Eshaan Rao, Peng Liu, John H. Reichl, David R. Borchelt, Laura S Hemmy, Karen H. Ashe
Publikováno v:
Alzheimer's & Dementia. 11
Autor:
Reinhart Jarisch, M. Winter, H. Reichl, I. Mayer, A. Missbichler, Felix Wantke, Margarete Focke
Publikováno v:
Allergologie. 28:1-8
Patients intolerant to histamine-containing foods (histamine intolerance) frequently suffer from diminished histamine degradation based on deficiency or reduced activity of the enzyme diamine oxidase (DAO). Here, we present an easy-to-use, commercial
Publikováno v:
Microsystem Technologies. 7:239-243
A packaging process for flip-chip LEDs (light emitting diodes) is described. The LEDs are picked and placed on a silicon substrate wafer. After reflow the substrates are individualized. AuSn solder is used for the interconnection. The solder compound