Equipment fault detection with fitted wafer surfaces.

Autor: Gardner, M.M., Lu, J.C., Gyuresik, R.S., Wortman, J.J., Hornung, B.E., Heinisch, H.H., Rying, E.A.

Publikováno v: Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium; 1996, p364-371, 8p