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Graphene Thermal Infrared Emitters Integrated into Silicon Photonic Waveguides.

Autor: Negm N; Advanced Microelectronic Center Aachen, AMO GmbH, Otto-Blumenthal-Str. 25, 52074 Aachen, Germany.; Chair of Electronic Devices (ELD), RWTH Aachen University, Otto-Blumenthal-Str. 25, 52074 Aachen, Germany., Zayouna S; Senseair AB, Stationsgatan 12, 824 08 Delsbo, Sweden.; Department of Applied Physics, KTH Royal Institute of Technology, Stationsgatan 12, 114 19 Stockholm, Sweden., Parhizkar S; Advanced Microelectronic Center Aachen, AMO GmbH, Otto-Blumenthal-Str. 25, 52074 Aachen, Germany.; Chair of Electronic Devices (ELD), RWTH Aachen University, Otto-Blumenthal-Str. 25, 52074 Aachen, Germany., Lin PS; Division of Micro- and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, 100 44 Stockholm, Sweden., Huang PH; Division of Micro- and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, 100 44 Stockholm, Sweden., Suckow S; Advanced Microelectronic Center Aachen, AMO GmbH, Otto-Blumenthal-Str. 25, 52074 Aachen, Germany., Schroeder S; Senseair AB, Stationsgatan 12, 824 08 Delsbo, Sweden., De Luca E; Senseair AB, Stationsgatan 12, 824 08 Delsbo, Sweden., Briano FO; Senseair AB, Stationsgatan 12, 824 08 Delsbo, Sweden., Quellmalz A; Division of Micro- and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, 100 44 Stockholm, Sweden., Duesberg GS; Institute of Physics, Faculty of Electrical Engineering and Information Technology (EIT 4) & SENS Research Centre, University of the Bundeswehr Munich, Werner-Heisenberg-Weg 39, 85577 Neubiberg, Germany., Niklaus F; Division of Micro- and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, 100 44 Stockholm, Sweden., Gylfason KB; Division of Micro- and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, 100 44 Stockholm, Sweden., Lemme MC; Advanced Microelectronic Center Aachen, AMO GmbH, Otto-Blumenthal-Str. 25, 52074 Aachen, Germany.; Chair of Electronic Devices (ELD), RWTH Aachen University, Otto-Blumenthal-Str. 25, 52074 Aachen, Germany.

Publikováno v: ACS photonics [ACS Photonics] 2024 Jun 26; Vol. 11 (8), pp. 2961-2969. Date of Electronic Publication: 2024 Jun 26 (Print Publication: 2024).

Correction: Integrated silicon photonic MEMS.

Autor: Quack N; École Polytechnique Fédérale de Lausanne (EPFL), 1015 Lausanne, Switzerland.; School of Aerospace, Mechanical and Mechatronic Engineering, The University of Sydney, Camperdown, NSW 2006 Australia., Takabayashi AY; École Polytechnique Fédérale de Lausanne (EPFL), 1015 Lausanne, Switzerland., Sattari H; École Polytechnique Fédérale de Lausanne (EPFL), 1015 Lausanne, Switzerland.; Swiss Center for Electronics and Microtechnology (CSEM), 2002 Neuchâtel, Switzerland., Edinger P; Division of Micro and Nanosystems, KTH Royal Institute of Technology, 114 28 Stockholm, Sweden., Jo G; Division of Micro and Nanosystems, KTH Royal Institute of Technology, 114 28 Stockholm, Sweden., Bleiker SJ; Division of Micro and Nanosystems, KTH Royal Institute of Technology, 114 28 Stockholm, Sweden., Errando-Herranz C; Division of Micro and Nanosystems, KTH Royal Institute of Technology, 114 28 Stockholm, Sweden., Gylfason KB; Division of Micro and Nanosystems, KTH Royal Institute of Technology, 114 28 Stockholm, Sweden., Niklaus F; Division of Micro and Nanosystems, KTH Royal Institute of Technology, 114 28 Stockholm, Sweden., Khan U; Department of Information Technology, Photonics Research Group, Ghent University - IMEC, Technologiepark-Zwijnaarde 126, 9052 Gent, Belgium., Verheyen P; imec vzw. 3DSIP Department, Si Photonics Group, Kapeldreef 75, 3001 Leuven, Belgium., Mallik AK; Tyndall National Institute, Lee Maltings Complex Dyke Parade, Cork, T12 R5CP Ireland., Lee JS; Tyndall National Institute, Lee Maltings Complex Dyke Parade, Cork, T12 R5CP Ireland., Jezzini M; Tyndall National Institute, Lee Maltings Complex Dyke Parade, Cork, T12 R5CP Ireland., Zand I; Department of Information Technology, Photonics Research Group, Ghent University - IMEC, Technologiepark-Zwijnaarde 126, 9052 Gent, Belgium., Morrissey P; Tyndall National Institute, Lee Maltings Complex Dyke Parade, Cork, T12 R5CP Ireland., Antony C; Tyndall National Institute, Lee Maltings Complex Dyke Parade, Cork, T12 R5CP Ireland., O'Brien P; Tyndall National Institute, Lee Maltings Complex Dyke Parade, Cork, T12 R5CP Ireland., Bogaerts W; Department of Information Technology, Photonics Research Group, Ghent University - IMEC, Technologiepark-Zwijnaarde 126, 9052 Gent, Belgium.

Publikováno v: Microsystems & nanoengineering [Microsyst Nanoeng] 2024 Jan 24; Vol. 10, pp. 17. Date of Electronic Publication: 2024 Jan 24 (Print Publication: 2024).

Correction: Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process.

Autor: Li Y; KTH Royal Institute of Technology, 11428 Stockholm, Sweden. frank@kth.se., Worsey E; University of Bristol, BS8 1UB Bristol, UK. Dinesh.Pamunuwa@bristol.ac.uk., Bleiker SJ; KTH Royal Institute of Technology, 11428 Stockholm, Sweden. frank@kth.se., Edinger P; KTH Royal Institute of Technology, 11428 Stockholm, Sweden. frank@kth.se., Kulsreshath MK; University of Bristol, BS8 1UB Bristol, UK. Dinesh.Pamunuwa@bristol.ac.uk., Tang Q; University of Bristol, BS8 1UB Bristol, UK. Dinesh.Pamunuwa@bristol.ac.uk., Takabayashi AY; École Polytechnique Fédérale de Lausanne (EPFL), 1015 Lausanne, Switzerland., Quack N; École Polytechnique Fédérale de Lausanne (EPFL), 1015 Lausanne, Switzerland., Verheyen P; IMEC, 3001 Leuven, Belgium., Bogaerts W; IMEC, 3001 Leuven, Belgium.; Ghent University, 9052 Gent, Belgium., Gylfason KB; KTH Royal Institute of Technology, 11428 Stockholm, Sweden. frank@kth.se., Pamunuwa D; University of Bristol, BS8 1UB Bristol, UK. Dinesh.Pamunuwa@bristol.ac.uk., Niklaus F; KTH Royal Institute of Technology, 11428 Stockholm, Sweden. frank@kth.se.

Publikováno v: Nanoscale [Nanoscale] 2023 Nov 30; Vol. 15 (46), pp. 18940. Date of Electronic Publication: 2023 Nov 30.

Three-dimensional printing of silica glass with sub-micrometer resolution.

Autor: Huang PH; Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, Stockholm, 10044, Sweden., Laakso M; Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, Stockholm, 10044, Sweden., Edinger P; Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, Stockholm, 10044, Sweden., Hartwig O; Institute of Physics, Faculty of Electrical Engineering and Information Technology, University of the Bundeswehr Munich & SENS Research Center, Neubiberg, 85577, Germany., Duesberg GS; Institute of Physics, Faculty of Electrical Engineering and Information Technology, University of the Bundeswehr Munich & SENS Research Center, Neubiberg, 85577, Germany., Lai LL; Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, Stockholm, 10044, Sweden., Mayer J; Central Facility for Electron Microscopy (GFE), RWTH Aachen University, Aachen, 52074, Germany., Nyman J; Department of Physics, Chemistry and Biology (IFM), Linköping University, Linköping, 58183, Sweden., Errando-Herranz C; Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, Stockholm, 10044, Sweden., Stemme G; Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, Stockholm, 10044, Sweden., Gylfason KB; Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, Stockholm, 10044, Sweden., Niklaus F; Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, Stockholm, 10044, Sweden. frank@kth.se.

Publikováno v: Nature communications [Nat Commun] 2023 Jun 07; Vol. 14 (1), pp. 3305. Date of Electronic Publication: 2023 Jun 07.