Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Guy Paul Brouillette"'
Autor:
Valerie Oberson, Da-Yuan Shih, M. R. Turgeon, H. Kimura, Guy Paul Brouillette, David Danovitch, Luc Belanger, Peter A. Gruber
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
A new wafer bumping technology is described that is especially suited for Pb-free applications. Although capable of using standard PbSn eutectic solder, IMS (injection molded solder) has been found to be especially suited for accommodating a wide ran
Autor:
Carlos J. Sambucetti, Sung K. Kang, Madhav Datta, Keith T. Kwietniak, R.A. Carruthers, Peter A. Gruber, P. C. Andricacos, J.M.E. Harper, Leathen Shi, Guy Paul Brouillette, David Danovitch, J. Horkans, John M. Cotte
Publikováno v:
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
In addition to the environmental issue regarding the use of Pb-bearing solders in microelectronics applications, there is another issue associated with using Pb-bearing solders in interconnections, like flip chip solder interconnections in an advance