Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Gurudutt Chennagiri"'
Autor:
Ross Havens, Krishnaswami Srihari, Ganesh Pandiarajan, Gurudutt Chennagiri, Satyanarayan Shivkumar Iyer
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
There is a continuous need for higher density memory modules for applications like servers, telecommunications, and networking. Memory modules with package stacked Dynamic Random-Access Memory (DRAM) devices were developed for these applications. Sta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a98418f4c3d08bd8a748fbe45dbc41e
https://doi.org/10.1109/ectc.2013.6575816
https://doi.org/10.1109/ectc.2013.6575816
Publikováno v:
2009 1st Asia Symposium on Quality Electronic Design.
The growth in demand for memory capacity is surpassing the pace at which memory component manufacturers are able to cost-effectively produce the next generation of monolithic memory devices. This drives the need for utilizing stacked components for m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f7db3cb7878603853bfeaf42875fe66
https://doi.org/10.1109/asqed.2009.5206268
https://doi.org/10.1109/asqed.2009.5206268
Publikováno v:
ASME 2007 InterPACK Conference, Volume 1.
The introduction of new products to the manufacturing environment is a challenging task. The extent of this challenge varies depending on the complexity of the product being introduced. Fully Buffered Dual In-line Memory Modules (FBDIMMs), which have
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c6a2a9c6976171002fafe55714904b54
https://doi.org/10.1115/ipack2007-33678
https://doi.org/10.1115/ipack2007-33678