Výsledky vyhledávání - "Gurijala Deepthi"

Crosstalk analysis of dielectric inserted side contact multilayer graphene nanoribbon interconnects for ternary logic system using unconditionally stable FDTD model

Autor: Gurijala Deepthi, Madhavi Tatineni

Publikováno v: Microelectronics Journal. 133:105698

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::68497f5fa2e9decea25b519e56b53990
https://doi.org/10.1016/j.mejo.2023.105698

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Comparative Analysis of Crosstalk Effects in Dielectric Inserted Horizontal andVertical Multi-layer GNR Interconnects for Ternary Logic System

Autor: Gurijala Deepthi, Madhavi Tatineni

Publikováno v: ECS Journal of Solid State Science and Technology. 11:081004

In this work, the performance of copper (Cu), dielectric inserted horizontal graphene nanoribbon (Di-HGNR) interconnect and dielectric inserted vertical graphene nanoribbon (Di-VGNR) interconnects are investigated using active shielding and passive s

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::bfd1c35898fb551df70f9e5523ab7595
https://doi.org/10.1149/2162-8777/ac8373

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Quality of Signal Improvement in Prominent CNTFET Based Ternary Logic System for Futuristic Dielectric Inserted MLGNRs for Integrated Circuit Designs

Autor: Gurijala Deepthi, Madhavi Tatineni

Publikováno v: ECS Journal of Solid State Science and Technology. 11:031003

Booming VLSI technology has graciously facilitated down-scaling dimensions of on-chip devices and interconnects in integrated circuits (ICs) to nano-miniaturized scale. However, at nano-dimensions where added benefits of scaling are constrained by as

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::3324b721a0d22c8f8aeb36b6501bd125
https://doi.org/10.1149/2162-8777/ac5a71

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Impact of Temperature on Structure Deformation for Monolithic Inter-Tier vias In Monolithic 3D IC Packaging System

Autor: Gurijala Deepthi, Madhavi Tatineni, Girish Kumar Mekala

Publikováno v: ECS Journal of Solid State Science and Technology. 10:111002

The approach of monolithic 3D IC (M3D) integration using monolithic inter-tier-vias (MIVs) as interconnect structures is considered. Although, M3D ICs show many benefits of heterogeneous integration without significant area overhead compared to 3D IC

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::58c3295572c55b4ab2d836ed4c1a6227
https://doi.org/10.1149/2162-8777/ac31cd

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