Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Guowei David Xiao"'
Autor:
Xin Shihan, Xin Zhang, He Xiaowu, Guowei David Xiao, Kai Zhang, Deng Shaojia, Xinlu Liu, Yang Chai, Anhui Zhong
Publikováno v:
Nanotechnology. 32(31)
Sintered nano-copper is becoming a promising candidate as thermal interface material (TIM) for die attaching in high power electronics. It exhibits much higher thermal conductivity and operating temperature than conventional TIMs based on polymer and
Autor:
Kai Zhang, Jie Li, Chuiming Wan, Zhaoming Zeng, Lisa Liu, Matthew Ming Fai Yuen, Deng Shaojia, Xin Shihan, He Xiaowu, Chengqiang Cui, Yunbo He, Yu Zhang, Cheng Sheng Ku, Guowei David Xiao
Publikováno v:
Materials Letters. 235:216-219
High thermal conductivity, low viscosity and high transparency are desired properties of die attach adhesives (DAA) for LEDs to achieve high thermal and optical performance as well as good reliability. However, it is challenging for DAAs with thermal
Autor:
Xinfeng Zhang, Kai Zhang, Zhaoming Zeng, Lisa Liu, Guowei David Xiao, Chuiming Wan, Yuhua Lee, Cheng Sheng Ku, Matthew Ming Fai Yuen, Jie Li
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Transparent die attach materials (DA) with moderate thermal conductivity without yellowing are preferred for mid-power LEDs, which dominate the LED backlighting and general solid-state lighting markets. A novel DA was developed based on a new kind of