Zobrazeno 1 - 10
of 37
pro vyhledávání: '"Guo-ji Zhao"'
Autor:
Zhang, Yu-Ying, Zhang, Qian, Zhang, Yue-Ming, Wang, Wei-Wei, Zhang, Li, Yu, Yong-Jie, Bai, Chang-Cai, Guo, Ji-Zhao, Fu, Hai-Yan, She, Yuanbin
Publikováno v:
In Journal of Chromatography A 12 April 2020 1616
Publikováno v:
In Journal of Electroanalytical Chemistry 2008 612(2):277-287
Publikováno v:
In Journal of Photochemistry & Photobiology, A: Chemistry 2008 197(1):55-61
Publikováno v:
In Journal of Photochemistry & Photobiology, A: Chemistry 2008 193(2):89-96
Publikováno v:
Transactions of Nonferrous Metals Society of China. 27:234-240
The effects of rapid solidification on the microstructure and melting behavior of the Sn–8Zn–3Bi alloy were studied. The evolution of the microstructural characteristics of the solder/Cu joint after an isothermal aging at 150 °C was also analyze
Autor:
Shang, Ping-ping, Zhao, Ge, Li, Xiang, Hua, Chen-feng, Zhang, Yi-chun, Zhao, Jun-wei, Wang, Sheng, Sun, Pei-jian, Guo, Jun-wei, Fan, Mei-juan, Guo, Ji-zhao, Zheng, Sai-jing, Pan, Li-ning, Lu, Cheng-wei, Xie, Fu-wei, Peng, Gui-xin
Publikováno v:
Contributions to Tobacco & Nicotine Research; Jul2021, Vol. 30 Issue 3, p138-148, 11p
Akademický článek
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Publikováno v:
Transactions of Nonferrous Metals Society of China. 22:1954-1960
The influence of isothermal aging at 150 °C on the microstructural characteristics and microhardness of the Sn-6.5Zn solder/Cu joint was studied. The mechanisms for the formation and evolution of intermetallic compound (IMC) at the interface of the
Publikováno v:
Journal of Electronic Materials. 41:2100-2106
Rapidly solidified Sn-9Zn-0.1Cr alloy foils were obtained by the melt-spinning method. The solder characteristics of this rapidly solidified alloy were analyzed and compared with those of as-solidified Sn-9Zn and Sn-9Zn-0.1Cr alloys. The mechanical p
Publikováno v:
Materials Letters. 68:129-132
An alloy foil of rapidly solidified Sn-9Zn-0.1Cr was produced by the melt-spinning technique. The mechanical properties of the Cu/Sn-9Zn-0.1Cr/Cu joints prepared by the rapidly solidified and the as-solidified solders were investigated. The results s