Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Gunjan Reena"'
Publikováno v:
ITM Web of Conferences, Vol 53, p 02006 (2023)
Sentiment analysis is a rapidly growing field in natural language processing that aims to extract subjective information from text data. One of the most common applications of sentiment analysis is in the movie industry, where it is used to gauge pub
Externí odkaz:
https://doaj.org/article/871fbdd7241b4f538a97561d3017afcb
Publikováno v:
Journal of Engineering Education Transformations; Oct2023, Vol. 37 Issue 2, p200-208, 9p
Autor:
Goyal Aparna, Gunjan Reena
Publikováno v:
E3S Web of Conferences, Vol 170, p 03007 (2020)
Texture analysis has proven to be a breakthrough in many applications of computer image analysis. It has been used for classification or segmentation of images which requires an effective description of image texture. Due to high discriminative power
Externí odkaz:
https://doaj.org/article/9bafa742ba8542fea0ffa1ea14436f80
Autor:
Raut Vrushali, Gunjan Reena
Publikováno v:
E3S Web of Conferences, Vol 170, p 03005 (2020)
Wireless capsule endoscopy (WCE) is medical examination process for gastrointestinal tract (GIT). This noninvasive multi advantageous procedure can be made more popular by overcoming the problem of prolonged analysis time. Video summarization is a co
Externí odkaz:
https://doaj.org/article/17da1838b04149619d921923e44ad582
Publikováno v:
Computer Methods in Biomechanics & Biomedical Engineering: Imaging & Visualisation; May2023, Vol. 11 Issue 3, p606-622, 17p
Autor:
Pangaonkar, Satyajit, Gunjan, Reena
Publikováno v:
International Journal of Medical Engineering and Informatics; 2023, Vol. 15 Issue: 3 p245-256, 12p
Autor:
Raut, Vrushali, Gunjan, Reena
Publikováno v:
International Journal of Information Technology; June 2022, Vol. 14 Issue: 4 p2183-2190, 8p
Publikováno v:
E3S Web of Conferences; 2020, Vol. 170, pN.PAG-N.PAG, 4p
Publikováno v:
E3S Web of Conferences; 2020, Vol. 170, pN.PAG-N.PAG, 4p
Autor:
Pangaonkar, Satyajit, Gunjan, Reena
Publikováno v:
International Journal of Simulation and Process Modeling; 2021, Vol. 16 Issue: 4 p300-314, 15p