Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Gum J. Bae"'
Autor:
Kyu−Chil Park, Jun Hee Lee, Il Kwon Kim, Wan D. Kim, Byoung Hun Lee, Sang I. Lee, Giho Cha, Kyung Wook Lee, Gum J. Bae, Young Bum Koh
Publikováno v:
Japanese Journal of Applied Physics. 36:1912
In patterned wafer bonding process, the debonded area occurring at bonding interface results from the poor wafer flatness of patterned wafer or from the different bonding speed in each position of the wafer. By reducing pressure when bonding occurs a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4a75c99a59ad24eaf5aa65a3cb5f438
https://doi.org/10.1143/jjap.36.1912
https://doi.org/10.1143/jjap.36.1912
