Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Gul Bahar Basim"'
Autor:
Zeynep Ozdemir, Gul Bahar Basim
Publikováno v:
Data in Brief, Vol 10, Iss C, Pp 20-25 (2017)
Bioactivity of titanium depends on the quality and characteristics of its surface oxide film. Through implementation of chemical mechanical polishing (CMP) process on titanium plates, a protective oxide (titania) film grows on the titanium based impl
Externí odkaz:
https://doaj.org/article/c978da857f3b4aabbce18b7423cde551
Autor:
Asena Cerhan-Haink, Gul Bahar Basim
Publikováno v:
Journal of Surfactants and Detergents. 23:433-444
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a86b63fd3ffcc38628215db8af212e1
https://doi.org/10.1002/jsde.12380
https://doi.org/10.1002/jsde.12380
Publikováno v:
The International Journal of Prosthodontics.
PURPOSE To evaluate the effect of different treatments applied to titanium implant abutment surfaces on the retention of implant-supported cement-retained crowns using resin cement. MATERIALS AND METHODS A total of 72 titanium implant abutments were
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3d79e58f59175e35166e53e726930422
https://doi.org/10.11607/ijp.6602
https://doi.org/10.11607/ijp.6602
Autor:
Gul Bahar Basim
Publikováno v:
ECS Meeting Abstracts. :828-828
This is a review paper on the effect of chemicals modified thin films on CMP process development. As the microelectronics manufacturing faces the challenges related to the Beyond Moore’s Scale adaptation, Chemical Mechanical Planarization (CMP) pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91421c882f65fe4b1139bd4db3f0892e
https://doi.org/10.1149/ma2021-0120828mtgabs
https://doi.org/10.1149/ma2021-0120828mtgabs
Publikováno v:
ECS Meeting Abstracts. :806-806
Nano-scale modification of macro-scale 3-dimensional implantable devices is gaining more attention as the cell attachment/detachment mechanisms at the bio-interfaces are profoundly affected by the nanoscale interfacial interactions [1]. Titanium base
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c307107a97bcbdd7eeab7fb2ef0e54a
https://doi.org/10.1149/ma2021-0120806mtgabs
https://doi.org/10.1149/ma2021-0120806mtgabs
Publikováno v:
Mineral Processing on the Verge of the 21st Century.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6b26e41eaaac11bfb171adfe0215c2f
https://doi.org/10.4324/9780203747117-16
https://doi.org/10.4324/9780203747117-16
Due to copyright restrictions, the access to the full text of this article is only available via subscription. Modification of the implantable biomaterial surfaces is known to improve the biocompatibility of metallic implants. Particularly, treatment
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3e859ad6aa2bdd7c7c7797bf520d6a53
https://hdl.handle.net/10679/4337
https://hdl.handle.net/10679/4337
Autor:
S. Kincal, Gul Bahar Basim
Publikováno v:
Journal of Electronic Materials. 42:83-96
Due to copyright restrictions, the access to the full text of this article is only available via subscription. Chemical mechanical planarization (CMP) has been proven to be the best method to achieve within-wafer and within-die uniformity for multile
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c9c3ebda0de0a2458521bfc35150ac5a
https://doi.org/10.1007/s11664-012-2250-z
https://doi.org/10.1007/s11664-012-2250-z
Autor:
Gul Bahar Basim
Due to copyright restrictions, the access to the full text of this article is only available via subscription. The conventional demands for development in semiconductor industry are changing as the Moore's Law is approaching to its limits. This paper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ec3d1103b1e6455e3818a815c5ce7680
https://hdl.handle.net/10679/2804
https://hdl.handle.net/10679/2804
Publikováno v:
MRS Proceedings. 732
The main objective of Chemical Mechanical Polishing (CMP) process is to planarize the metal or dielectric layers deposited on the wafer surfaces in microelectronics device manufacturing. In CMP, slurries containing submicrometer size particles and ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ff6ccdfefbb8d5402fe47614c22ba96
https://doi.org/10.1557/proc-732-i3.5
https://doi.org/10.1557/proc-732-i3.5