Effects of probe damage on wire bond integrity.

Autor: Hotchkiss, G., Ryan, G., Subido, W., Broz, J., Mitchell, S., Rincon, R., Rolda, R., Guimbaolibot, L.

Publikováno v: 2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p1175-1180, 6p