Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Guillaume Schelcher"'
Autor:
Roy Anunciado, Jisun Lee, Ellaheh Barzegar, Stefan van der Sanden, Guillaume Schelcher, Stijn Schoofs
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2022.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac7b248aa9324a6f1b790485137600af
https://doi.org/10.1117/12.2637772
https://doi.org/10.1117/12.2637772
Autor:
Sandip Halder, Stephane Lariviere, Etienne de Poortere, Malgorzata Jurczak, Guillaume Schelcher, Stefan Decoster, Philippe Leray, David Hellin, Nicola Kissoon, Elisabeth Camerotto, Gayle Murdoch
Publikováno v:
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV.
EUV resists, while improving steadily, generate a number of nanobridge or break defects that increases quickly as the pitch approaches 30 nm. Inline inspection methods are therefore needed to reliably detect patterning defects smaller than 20 nm. Mas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab79d1f60807fcf652fea970e2f31a9e
https://doi.org/10.1117/12.2584807
https://doi.org/10.1117/12.2584807
Autor:
Igor Turovets, Anne-Laure Charley, Philippe Leray, Sandip Halder, Sayantan Das, Avron Ger, Joey Hung, Roy Koret, Mohamed Saib, Matthew Sendelbach, Guillaume Schelcher
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIII.
This paper, originally published on 26 March 2019, was replaced with a corrected/revised version on 25 June 2019. If you downloaded the original PDF but are unable to access the revision, please contact SPIE Digital Library Customer Service for assis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d2f512bf393e749655037f3ec1acd6f
https://doi.org/10.1117/12.2541616
https://doi.org/10.1117/12.2541616
Autor:
Hastings Simon Philip Spencer, Etienne de Poortere, Yongjun Wang, Vito Rutigliani, Guillaume Schelcher, Cyrus E. Tabery, Luke wang, Philippe Leray
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIII.
Voltage contrast (VC) is a long known and well established technique to give combined inline sensitivity to electrically relevant measures of defectivity but also local defect isolation and integrated review SEM making the technique a critical piece
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69379b7547c61a25cd1ef4d1c37517a1
https://doi.org/10.1117/12.2516613
https://doi.org/10.1117/12.2516613
Autor:
Avron Ger, Sandip Halder, Guillaume Schelcher, Mohamed Saib, Igor Turovets, Philippe Leray, Anne-Laure Charley, Joey Hung, Matthew Sendelbach, Roy Koret, Sayantan Das
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIII.
With growing process complexity and the increasing number of process steps, early prediction of device performance has become an important task in semiconductor manufacturing process control. Machine learning (ML) techniques allow us to link in-line
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed289222543e14bd4c7794011da613ea
https://doi.org/10.1117/12.2515806
https://doi.org/10.1117/12.2515806
Publikováno v:
Plasma Processes and Polymers. 13:869-878
A novel method for designing hydrophobicity of the polylactide / low-density polyethylene (PLA/PE-LD) blends by creating specific surface topography is proposed. In order to increase hydrophobicity by changing the topography of two-phase PLA polymer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1329125e8d7294ef813a43a60822c51a
https://doi.org/10.1002/ppap.201500218
https://doi.org/10.1002/ppap.201500218
Autor:
Kaushik A. Kumar, Carlos Fonseca, Ton Kiers, Florin Cerbu, Christophe Beral, Guillaume Schelcher, Liesbeth Reijnen, Marc Demand, Mark John Maslow, Tae Kwon Jee, Vadim Timoshkov
Publikováno v:
Optical Microlithography XXXI.
Spacer-assisted pitch multiplication is a patterning technique that is used on many different critical layers for memory and logic devices. Pitch walk can occur when the spacer process, a combination of lithography, deposition and etch processes, pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11190a340b0d6cb7f58d822d99c4ccc6
https://doi.org/10.1117/12.2297345
https://doi.org/10.1117/12.2297345
Autor:
Simeon Cavadias, Laurent Malaquin, Michael Tatoulian, Cédric Guyon, E. Martinez, Guillaume Schelcher, Velan Taniga, Patrick Tabeling, Stéphanie Ognier
Publikováno v:
Lab Chip. 14:3037-3042
The novelty of this paper lies in the development of a multistep process for the manufacturing of plasma millireactors operating at atmospheric pressure. The fabrication process relies on the integration of metallic electrodes over a cyclic olefin co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::db4cbe7895629175a6afd0b43443d9aa
https://doi.org/10.1039/c4lc00423j
https://doi.org/10.1039/c4lc00423j
Autor:
Michael Tatoulian, J. Mostafavi-Amjad, Guillaume Schelcher, Daniel Bonn, Mehdi Habibi, Hamid Reza Khalesifard, Stéphanie Ognier, B. Da Silva
Publikováno v:
European Physical Journal: Special Topics 225 (2016) 4
The European Physical Journal-Special Topics, 225(4), 707-714. Springer Verlag
European Physical Journal: Special Topics, 225(4), 707-714
The European Physical Journal-Special Topics, 225(4), 707-714. Springer Verlag
European Physical Journal: Special Topics, 225(4), 707-714
A new method for the elaboration of a novel type of catalytic microsystem with a high specific area catalyst is developed. A silver nanocluster catalytic microreactor was elaborated by doping a soda-lime glass with a silver salt. By applying a high p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::706a1b8be8b90bab6cb2452a274ccfa2
https://research.wur.nl/en/publications/silver-nanocluster-catalytic-microreactors-for-water-purification
https://research.wur.nl/en/publications/silver-nanocluster-catalytic-microreactors-for-water-purification
Autor:
Guillaume Schelcher, Elisabeth Dufour-Gergam, Sebastien Brault, Elie Lefeuvre, Filippo Fabbri, Fabien Parrain, Philippe Coste
Publikováno v:
Journal of Microelectromechanical Systems. 20:1184-1191
The novelty of this paper is the proof of functional microdevice fabrication using a recently developed low-temperature transfer process. The process is based on adhesion control of molded Ni microstructures on a donor wafer by using plasma-deposited
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::604a3fcfd9d36061367fda57effeb2fd
https://doi.org/10.1109/jmems.2011.2162492
https://doi.org/10.1109/jmems.2011.2162492