Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Guigen Ye"'
Publikováno v:
Nanoscale Research Letters, Vol 17, Iss 1, Pp 1-17 (2022)
Abstract Nano-cutting is an important development direction of the modern manufacturing technology. However, the research on the mechanism underlying nano-cutting lags far behind the practical application, which restricts the development of this adva
Externí odkaz:
https://doaj.org/article/227b17d9f2204641a28f14ba67eeb6b7
Publikováno v:
Materials & Design, Vol 219, Iss , Pp 110788- (2022)
In this paper, stability and mechanistic simulations for a four-beam-mass-based MEMS gravimeter were conducted, and guidelines for the gravimeter design were proposed. Based on a prototyped MEMS device, the nonlinear finite element model was validate
Externí odkaz:
https://doaj.org/article/6ef2f8e0f4a944b08a7aa9a6ab52268e
Publikováno v:
Machines, Vol 11, Iss 3, p 357 (2023)
A ball cage flexible drill pipe is a new type of ultra-short-radius drilling tool, which consists of multiple flexible joints hinged together. During the drilling process, the flexible members will come into contact and wear, which reduces the effici
Externí odkaz:
https://doaj.org/article/e63238e98daa44288b725a8c68b53355
Publikováno v:
Energies, Vol 15, Iss 20, p 7591 (2022)
The flexible joint is an important part in ultra-short-radius drilling tools, and its structural parameters and motion characteristics are key factors affecting the success of drilling. In this work, a new type of ball cage flexible joint, which is a
Externí odkaz:
https://doaj.org/article/1abced18bef441da9dc4975666e1fd4d
Publikováno v:
Journal of Manufacturing Processes. 93:275-286
Publikováno v:
Journal of Engineering Science and Technology Review. 15:178-185
The contact stress of flexible joint is an important factor affecting the safety of ultra-short-radius drilling tools. However, calculating the contact stress accurately is difficult, because the method for solving the multibody collision of the flex
Publikováno v:
Microelectronics Reliability. 132
In this paper, we presented several practical aspects for building robust and reliable finite element models in thermomechanical modeling in electronics packaging using finite element analysis. Firstly, for layered or patterned structures, a homogeni
Publikováno v:
Journal of Physics: Conference Series. 2381:012011
Nano-sintered silver has broad development prospects in the field of electronic packaging due to its excellent thermal conductivity and feasibility at low sintering temperatures. In this paper, by using molecular dynamics simulations, a single nano-s
Publikováno v:
Computers, Materials & Continua; 2016, Vol. 51 Issue 1, p21-42, 22p