A method for the determination of the thermally induced optical and structural changes of polymers used to fabricate lightpipes integrated in CMOS image sensor arrays

Autor: Marinelli, Rino, Palange, Elia, Faccio, Marco, Guerrieri, Stefano, Del Monte, Andrea, De Amicis, Giovanni, D’Anna, Alfonso

Publikováno v: In Sensors & Actuators: A. Physical 2011 167(2):385-388

A 7-band CCD-in-CMOS multispectral TDI imager

Autor: San Segundo Bello, David, De Bock, Maarten, Boulenc, Pierre, Vandebriel, Roeland, Wu, Linkun, Van Olmen, Jan, Malandruccolo, Vezio, Craninckx, Jan, Haspeslagh, Luc, Guerrieri, Stefano, Rosmeulen, Maarten, Borremans, Jonathan

We have developed a TDI sensor with 7 bands of 256 rows each using imec's CCD-in-CMOS technology. Each band uses individual on-chip sequencers and CCD drivers for the 5.4 µm four-phase TDI pixels. Line-by-line row selection per band, individual band

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od______3848::91a98bb21b2ac86671ff414be65e70d2
https://biblio.vub.ac.be/vubir/a-7band-ccdincmos-multispectral-tdi-imager(c17b568e-cb7e-42bf-b51c-689dff8c6218).html

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Cobalt UBM for fine pitch microbump applications in 3DIC.

Autor: Derakhshandeh, Jaber, De Preter, Inge, Vandersmissen, Kevin, Dictus, Dries, Di Piazza, Luca, Hou, Lin, Guerrieri, Stefano, Vakanas, George, Armini, Silvia, Daily, Robert, Lesniewska, Alicja, Vandelaer, Yannick, Van De Peer, Myriam, Slabbekoorn, John, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, Beyne, Eric

Publikováno v: 2015 IEEE International Interconnect Technology Conference & 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM); 2015, p221-224, 4p

Specification of Trace Metal Contamination for Image Sensors

Autor: Mertens, Paul W., Lavizzari, Simone, Guerrieri, Stefano

Publikováno v: Diffusion and Defect Data Part B: Solid State Phenomena; September 2016, Vol. 255 Issue: 1 p309-312, 4p