Zobrazeno 1 - 10
of 408
pro vyhledávání: '"Guanglei Wu"'
Autor:
Zhiqiang Guo, Di Lan, Zirui Jia, Zhenguo Gao, Xuetao Shi, Mukun He, Hua Guo, Guanglei Wu, Pengfei Yin
Publikováno v:
Nano-Micro Letters, Vol 17, Iss 1, Pp 1-21 (2024)
Highlights Excellent impedance matching through component modulation engineering. Rich heterogeneous interfaces are constructed to realize excellent electromagnetic wave (EMW) absorption performance. Long-term corrosion protection and excellent EMW a
Externí odkaz:
https://doaj.org/article/275ba4cdfe5845c4853b8cba27d5a5ec
Publikováno v:
工程科学学报, Vol 46, Iss 12, Pp 2191-2206 (2024)
With continuously evolving wireless communication technologies, the technological revolution marked by advances in artificial intelligence, the Internet of Things, and the metaverse is fundamentally reshaping our society, making it more convenient, i
Externí odkaz:
https://doaj.org/article/b103436da7a14652a30779550348ae96
Publikováno v:
Nano-Micro Letters, Vol 16, Iss 1, Pp 1-21 (2023)
Highlights The hierarchical porous structure is regulated by various species of PVP to achieve impedance matching. Interfacial engineering boosts conductivity and constructs a multiband (C, X, Ku) tunable electromagnetic wave absorber. Hierarchical p
Externí odkaz:
https://doaj.org/article/e96eae32528249c2b5fcf776f052636f
Publikováno v:
Nano-Micro Letters, Vol 15, Iss 1, Pp 1-24 (2023)
Highlights Electrospinning combined with structural engineering to construct 0D@2D@1D hierarchical heterogeneous interfaces. A “mechanical response” model was constructed to explain the stress transfer mechanism of fibrous membranes with 2D@1D st
Externí odkaz:
https://doaj.org/article/d60788294c5a4a58ab650d365e7695b8
Publikováno v:
Nano-Micro Letters, Vol 15, Iss 1, Pp 1-16 (2023)
Highlights NiCo/C aerogel was prepared by pyrolysis carbonization self-assembly of NiCo- metal–organic frameworks (MOFs). The assembly mechanism of MOF aerogel was studied by adjusting the ratio of metal ion /BTC. Aerogel combines hydrophobic, ligh
Externí odkaz:
https://doaj.org/article/6db3d359fd734d29aa92894ca40a0a20
Autor:
Hualiang Lv, Yuxing Yao, Shucong Li, Guanglei Wu, Biao Zhao, Xiaodi Zhou, Robert L. Dupont, Ufuoma I. Kara, Yimin Zhou, Shibo Xi, Bo Liu, Renchao Che, Jincang Zhang, Hongbin Xu, Solomon Adera, Renbing Wu, Xiaoguang Wang
Publikováno v:
Nature Communications, Vol 14, Iss 1, Pp 1-9 (2023)
The electromagnetic (EM) energy released by electronic devices in the environment is largely wasted and contributes to EM pollution. Here, the authors report the synthesis of staggered circular nanoporous graphene enabling the absorption and conversi
Externí odkaz:
https://doaj.org/article/c4399dddffdb47b2993be2da4540de8f
Publikováno v:
Nano-Micro Letters, Vol 15, Iss 1, Pp 1-16 (2022)
Highlights Heterogeneous interface engineering is designed by electrospinning. The introduction of Co3SnC0.7 nanoparticles increased the loss mechanism. Enhanced electromagnetic loss and improved impedance matching are achieved. The absorbers exhibit
Externí odkaz:
https://doaj.org/article/68752b57f50241639020f0f708af1014
Publikováno v:
Nano-Micro Letters, Vol 13, Iss 1, Pp 1-16 (2021)
Abstract Layered double hydroxides (LDHs) have a special structure and atom composition, which are expected to be an excellent electromagnetic wave (EMW) absorber. However, it is still a problem that obtaining excellent EMW-absorbing materials from L
Externí odkaz:
https://doaj.org/article/4eef18f38e574299bac164ea4c49ffc2
Publikováno v:
Nature Communications, Vol 12, Iss 1, Pp 1-8 (2021)
Materials that can harvest electromagnetic (EM) waves and harness the resulting energy would have many applications. Here, the authors present a hybrid composite that produces thermoelectricity from the heating in the EM absorption under microwave ra
Externí odkaz:
https://doaj.org/article/d698a2286e484194bf2d14dfc96bef7b
Autor:
Zhengdong Wang, Guodong Meng, Liangliang Wang, Liliang Tian, Siyu Chen, Guanglei Wu, Bo Kong, Yonghong Cheng
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-11 (2021)
Abstract Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high ele
Externí odkaz:
https://doaj.org/article/e5340b60ab5946f0a4ca19f03187903e