Zobrazeno 1 - 10
of 89
pro vyhledávání: '"Guang-Hwa Shiue"'
Autor:
Guang-Hwa Shiue, Chien-Yuan Huang, Chih-Hsin Lu, Ping-yueh Lai, Yu-Xiang Wang, Wei-Min Che, Shih-Chieh Lin
Publikováno v:
2019 Electrical Design of Advanced Packaging and Systems (EDAPS).
Far-end crosstalk is well known to contribute to the voltage drop in the TDR (time-domain reflection) waveform in a single-end serpentine delay line. However, for a small and practical single-end serpentine delay line in a practical Server PCB, both
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d93447e566295d407b82a601f2e58075
https://doi.org/10.1109/edaps47854.2019.9011674
https://doi.org/10.1109/edaps47854.2019.9011674
Publikováno v:
Progress In Electromagnetics Research B. 75:111-129
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5443b0764dbacb2a01f1372cbb2c4a12
https://doi.org/10.2528/pierb16111703
https://doi.org/10.2528/pierb16111703
Autor:
Chun-Fu Huang, Zhong-Yan You, Ting-Chun Wang, Kuang-Yi Wu, Guang-Hwa Shiue, Ming-Yuan Chuang, Yu-Hsiang Cheng
Publikováno v:
Progress In Electromagnetics Research M. 58:29-41
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cdcc4a93761ae1d593e7a693b094935
https://doi.org/10.2528/pierm17032603
https://doi.org/10.2528/pierm17032603
Autor:
Ming-Wei Chang, Guang-Hwa Shiue, Chia-Hao Li, Kuang-Yi Wu, Mei-Yi Huang, Chun-Chieh Chuang, Ming-Yuan Chuang, Cloud Lai, Jay Lin, Yu-Hsiang Cheng
Publikováno v:
2018 Progress in Electromagnetics Research Symposium (PIERS-Toyama).
This work presents the reduction of reflection noise in signal trace routing through metal planes with a via stub in a thick multilayered PCB using high-impedance arc traces. The loading effect for signal trace routing through metal planes with a via
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca93b1b5fc394f40824ecb17a261d634
https://doi.org/10.23919/piers.2018.8597881
https://doi.org/10.23919/piers.2018.8597881
Publikováno v:
2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Channel loss is a dominant factor for the signaling performance of high-speed I/O's. Some platform design guides clearly specify the printed-circuit board (PCB) loss requirement. During the initial design stage for PCB material selection, platform de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a1e5d267286dd998a2f80b4ec196e53
https://doi.org/10.1109/impact.2017.8255939
https://doi.org/10.1109/impact.2017.8255939
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:1671-1683
This paper proposes a new structure to reduce the commonmode noise (CMN) of weakly coupled differential serpentine delay lines (DSDLs) in microstrip line structure. In the proposed CMN reductions structure, different-layer-routing-turned traces are u
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e88a59b12cde15078346a5d5131340e
https://doi.org/10.1109/tcpmt.2014.2348858
https://doi.org/10.1109/tcpmt.2014.2348858
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:1657-1670
This paper investigates how the longest differential via stubs in a thick multilayered printed circuit board (PCB) affect the time-domain transmission (TDT) waveform and eye diagram. A reduction scheme is also proposed to mitigate the influence of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11fbf733ea16faa591aa5a77cae7ef4d
https://doi.org/10.1109/tcpmt.2014.2348860
https://doi.org/10.1109/tcpmt.2014.2348860
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:870-881
This paper investigates how ground bounce noise (GBN) is generated by crosstalk noises for two parallel ground planes with a narrow open-stub line (NOSL) and adjacent signal traces in a multilayer package structure. A noise reduction scheme and desig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2cf9bbc1aa66c623a969aace3cdf6995
https://doi.org/10.1109/tcpmt.2014.2299281
https://doi.org/10.1109/tcpmt.2014.2299281
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:279-290
Plating stubs inevitably form in the manufactured processes for ball grid array packages. This paper investigates how the plating stub affects the time-domain transmission (TDT) waveform and eye diagram. A scheme for mitigating the effect of the plat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::929eb929766e33e5395fa0fdd636d19e
https://doi.org/10.1109/tcpmt.2013.2284029
https://doi.org/10.1109/tcpmt.2013.2284029
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:134-144
This paper presents a comprehensive investigation on an inexpensive and wideband common-mode noise suppression filter that uses a quarter-wavelength resonator. An equivalent transmission line model is also used to evaluate the effectiveness of the pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f959944b3287b8989fbf9c047b528281
https://doi.org/10.1109/tcpmt.2013.2278444
https://doi.org/10.1109/tcpmt.2013.2278444