Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Guan qiang Song"'
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78717ca869d61374cff4abb477878c86
https://doi.org/10.1109/icept56209.2022.9873251
https://doi.org/10.1109/icept56209.2022.9873251
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Most of the existing power chips are connected by wire bonding or copper sheet welding. With the development of high performance, small size, modularity and high power density of power devices, the packaging method starts to develop towards FO(Fan-ou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f555a85e7bb93983f4ae67cceb28407
https://doi.org/10.1109/icept52650.2021.9568216
https://doi.org/10.1109/icept52650.2021.9568216
Autor:
Jia ren Huo, De Bo Liu, Jun Tao Jun Wang, Huaiyu Ye, Guan qiang Song, Jing Jiang, Guoqi Zhang
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Power devices are developing for the small volume, high performance and modularization. With more and more application scenarios of Brushless Direct Current Motor (BLDC), MOSFET multi-chip module (MCM) is popular with people. However, the conventiona
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa9de28403a3d1cbe61bca7b28233165
https://doi.org/10.1109/estc48849.2020.9229816
https://doi.org/10.1109/estc48849.2020.9229816