Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Gretchen DeVries"'
Studies of Silane Adhesion Promoters on Silica Filler Particles for use in Microelectronic Packaging
Publikováno v:
MRS Proceedings. 710
To avoid delamination which often occurs in microelectronic packaging as a result of widely varying thermal expansion coefficients, epoxy underfill is often loaded with particulate silica filler. This filler typically complicates the fracture behavio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7eaf17b71b01ac4e4ed13217f1f5d8f
https://doi.org/10.1557/proc-710-d10.10.1
https://doi.org/10.1557/proc-710-d10.10.1
Autor:
J. M. Snodgrass, Reinhold H. Dauskardt, Aaron Chesterman, John C. Bravman, Maura Jenkins, Gretchen DeVries
Publikováno v:
MRS Proceedings. 682
Silane adhesion promoters are seeing increasing use in microelectronic packaging applications. For example, they are currently used to adhere the passivating polymer overlayer to oxide. In this paper, we present detailed studies of silane adhesion pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d35c6270aa6523a9edbdbb8237aa80e5
https://doi.org/10.1557/proc-682-n6.4
https://doi.org/10.1557/proc-682-n6.4