Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Gregory M. Chrysler"'
Publikováno v:
Proceedings of the IEEE. 94:1476-1486
Increasing microprocessor performance has historically been accompanied by increasing power and increasing on-chip power density, both of which present a cooling challenge. In this paper, the historical evolution of power is traced and the impact of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2daeaf316b55a8ccec39377a4643c41
https://doi.org/10.1109/jproc.2006.879800
https://doi.org/10.1109/jproc.2006.879800
Autor:
J. Torresola, Abhay A. Watwe, Ravi Prasher, Gregory M. Chrysler, D. Grannes, Chia-Pin Chiu, Ravindranath V. Mahajan
Publikováno v:
IEEE Transactions on Advanced Packaging. 28:659-664
In the microelectronics industry, power has traditionally been the key driver for thermal management. Cooling solutions are typically rated in terms of their power dissipation capacity and efficiency. However, overall power is not the only parameter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9821337e0007f5970594f6f1709b78a7
https://doi.org/10.1109/tadvp.2005.858439
https://doi.org/10.1109/tadvp.2005.858439
Autor:
Gregory M. Chrysler, Gaurang N. Choksi, Vasudeva Atluri, Chia-Pin Chiu, John Tang, Priyavadan R. Patel, Debendra Mallik, Ravi Mahajan, Ram S. Viswanath, Vijay S. Wakharkar
Publikováno v:
MRS Bulletin. 28:21-34
Historically, the primary function of microprocessor packaging has been to facilitate electrical connectivity of the complex and intricate silicon microprocessor chips to the printed circuit board while providing protection to the chips from the exte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99257b7b35e9a9b34903e807629e728e
https://doi.org/10.1557/mrs2003.14
https://doi.org/10.1557/mrs2003.14
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 25:621-628
Presently, the microelectronics industry needs thermal solutions that are able to dissipate high heat fluxes at low thermal resistance. The majority of original equipment manufacturers (OEMs) within the microelectronics industry would like to achieve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::293e986c1c7da0ba61116f30d54528ac
https://doi.org/10.1109/tcapt.2002.807994
https://doi.org/10.1109/tcapt.2002.807994
Autor:
Kelly Lofgreen, David A. Koester, Ravi Mahajan, Ihtesham Chowdhury, Randall G. Alley, Rama Venkatasubramanian, Gregory M. Chrysler, Ravi Prasher, Sridhar Narasimhan
Publikováno v:
Nature nanotechnology. 4(4)
There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c616d866093c3344e2953fedf6eee5e3
https://pubmed.ncbi.nlm.nih.gov/19350027
https://pubmed.ncbi.nlm.nih.gov/19350027
Autor:
Dereje Agonafer, Gregory M. Chrysler, Ravi Mahajan, Abhijit Kaisare, A. Haji-Sheikh, Uthaman Raju
Publikováno v:
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Microprocessors continue to grow in capabilities, complexity and performance. Microprocessors typically integrate functional components such as logic and level two (L2) cache memory in their architecture. This functional integration of logic and memo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28a0b50d747f6782050203586572c295
https://doi.org/10.1109/itherm.2008.4544302
https://doi.org/10.1109/itherm.2008.4544302
Publikováno v:
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Solid state refrigeration technologies claim no moving parts and could possibly be one of the promising technologies for electronic cooling in the future. This paper focuses on the use of a thin film thermoelectric cooler (TFTEC) directly above the h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd709496a56e3513593dc1333514a181
https://doi.org/10.1109/itherm.2006.1645380
https://doi.org/10.1109/itherm.2006.1645380
Publikováno v:
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
The shrinking transistor feature sizes have resulted broadly in two different packaging thermal challenges; cooling the total thermal design power of the microprocessor, and thermal suppression of the hot spots which have progressively higher heat fl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::581dfbadc9580cb71b9cd912182b6ba8
https://doi.org/10.1109/itherm.2006.1645381
https://doi.org/10.1109/itherm.2006.1645381
Publikováno v:
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Decrease in the transistor features have resulted in increased challenges of cooling the hotspots in addition to cooling the overall die. In addition, future packaging concepts of stacked die exacerbate the need for spot-cooling thermal solution. Thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a215b167915f05e34cfec370a39f688
https://doi.org/10.1109/itherm.2006.1645382
https://doi.org/10.1109/itherm.2006.1645382
Autor:
Gregory M. Chrysler, Hakan Erturk, Je-Young Chang, Ravi Prasher, Ioan Sauciuc, Chia-Pin Chiu, Ravi Mahajan
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
Over the past few years, thermal design for cooling microprocessors has become increasingly challenging mainly because of an increase in both average power density and local power density, commonly referred to as “hot spots”. The current air cool
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de9cd19e80468cd479c368885a502c15
https://doi.org/10.1115/ipack2005-73242
https://doi.org/10.1115/ipack2005-73242