Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Gregory Braeckelmann"'
Autor:
James P. McVittie, Joseph S. Han, John J. Sullivan, Eric Eisenbraun, Gregory Braeckelmann, Dirk Manger, Aaron Burke, James F. Loan, Alain E. Kaloyeros, David Bang
Publikováno v:
Journal of Applied Physics. 82:4651-4660
Copper profile evolution in ultralarge scale integration via and trench structures was investigated for thermal low pressure, low temperature, chemical vapor deposition (LPCVD) from CuI(tmvs)(hfac). The investigation examined copper profiles in speci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af37c1593cdc16c6b08aeb69bfcd1058
https://doi.org/10.1063/1.366204
https://doi.org/10.1063/1.366204
Autor:
Thomas R. Omstead, Dirk Manger, Aaron Burke, James F. Loan, Gregory Braeckelmann, Alain E. Kaloyeros, John J. Sullivan, Cindy Reidsema, Gregory G. Peterson
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 14:1828
In this article, the authors report the results of a study aimed at optimizing a manufacturable thermal copper‐chemical vapor deposition process, using (tmvs) CuI (hfac) as the source, where tmvs=trimethylvinylsilane and hfac=hexafluoroacetylaceton
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59c2b8a6a6b97762885a2be8381051c6
https://doi.org/10.1116/1.588563
https://doi.org/10.1116/1.588563