Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Gregg Shin"'
Autor:
Chidi Chidambaram, Tae Park, Gregg Shin, Christopher L. Borst, Tamba Tugbawa, Duane S. Boning
Publikováno v:
Journal of The Electrochemical Society. 151:C418
In this paper, a methodology for the characterization and modeling of pattern-dependent problems in copper interconnect topography is presented. For the electroplating process, the methodology consists of test structure and mask design to examine fea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::838b49bc0038fb2a68bc5c50b19bcbb1
https://doi.org/10.1149/1.1723496
https://doi.org/10.1149/1.1723496
