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Autor:
Adriana Lapadatu, Knut E. Aasmundtveit, Greg R. Hayes, H. J. van de Wiel, Astrid-Sofie B. Vardoy, Stian Martinsen, Maaike M. Visser Taklo, Hartmut R. Fischer
Publikováno v:
International Symposium on Microelectronics. 2013:000717-000722
Hermetic wafer-level Cu-Sn solid-liquid interdiffusion (SLID) bonding was investigated to explore the sensitivity of selected process parameters with regard to voiding and possible reduction of strength. Little or no variation was observed in the voi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3975b974aa40ce4bb1f793828ef52be9
https://doi.org/10.4071/isom-2013-wp44
https://doi.org/10.4071/isom-2013-wp44
