Zobrazeno 1 - 10
of 46
pro vyhledávání: '"Greg Baty"'
Publikováno v:
Journal of Electronic Materials. 51:1169-1179
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::acaf72a280e3c1890cd9b71c46a20a6c
https://doi.org/10.1007/s11664-021-09379-5
https://doi.org/10.1007/s11664-021-09379-5
Publikováno v:
Journal of Electronic Materials. 50:4991-4998
Press-fit technology provides an electrical and mechanical connection by inserting a press-fit pin into a through-hole of a printed circuit board (PCB). Recently, there has been a wide interest in the long-term reliability of the press-fit pin interc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f456ca417ec9da0fe15e6b2e6b391d7
https://doi.org/10.1007/s11664-021-09045-w
https://doi.org/10.1007/s11664-021-09045-w
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:2853-2864
This paper reports experimental observations showing that a current flow produces an effect of strengthening a solder joint against a shear load. This conclusion is found from a single-joint shear test conducted on Sn–1Ag–0.5Cu wt% (SAC 105) join
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06b83a04d57aa02810fc65fbbe763b32
https://doi.org/10.1007/s10854-020-05038-3
https://doi.org/10.1007/s10854-020-05038-3
Publikováno v:
Journal of Surface Mount Technology. 33:22-27
Various external load conditions affecting components on electronic devices and modules are constant factors, which need to be considered for the component long-term reliability. Recently, to enhance the high stress component thermo-mechanical cyclin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d10209401f981c4bc049084e2acc9d4
https://doi.org/10.37665/smt.v33i2.10
https://doi.org/10.37665/smt.v33i2.10
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Mechanical integrity of low-k dielectric films remains a quality and reliability challenge for devices using advanced silicon nodes. In wafer fabs, while great efforts are made in controlling and monitoring individual processing steps, the overall me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b3c86ef069abae774fb1d43287dd504
https://doi.org/10.1109/ectc32696.2021.00139
https://doi.org/10.1109/ectc32696.2021.00139
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Large body-size and heterogeneously integrated packages have become essential for high-performance computing applications. As an example, designs such as silicon interposer-based 2.5D packages have enabled the integration of high-performance silicon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ece08640f311c5503a1a3844a8f209af
https://doi.org/10.1109/ectc.2019.00171
https://doi.org/10.1109/ectc.2019.00171
Publikováno v:
Journal of Electronic Materials. 45:6177-6183
The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from roo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::943bedfe2bd5a56cd1afebe5192411d5
https://doi.org/10.1007/s11664-016-4902-x
https://doi.org/10.1007/s11664-016-4902-x
Publikováno v:
Microscopy and Microanalysis. 21:2139-2140
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e936b1483fc320673dfb0d5c308f5d32
https://doi.org/10.1017/s1431927615011472
https://doi.org/10.1017/s1431927615011472