Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Graycochea, Edwin M."'
Micro module packages are normally with tape and reel process in semiconductor manufacturing industry. This thin package comes with a tape carrier wherein silicon die was attached and a yellow spacer is placed to support the tape in winding the whole
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::63b4b3aea4f060353609040fe11ed8dc
Introduction of technology innovation in semiconductor industry are getting more complex in terms of materials, designs, processes and other factors that can cause issues. One major challenge in die attach is the design of the indexer top plate. This
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::28fbe778911c5dc0dfdd8362eafd4e5c
In semiconductor assembly manufacturing wherein the competition is tough among all the semiconductor industries, one main factor to consider is the cost of a material. This paper discussed how the product was managed to be competitive in terms of man
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::237698c2bf007793832c581b1248ca4b
Non-conductive die attach film (DAF) is normally used as adhesive to connect or attach the silicon die into the leads without any electrical connection to its carrier or leadframe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2283cde8e05ff5c49ec332c3c7edab95