Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Grant T, Hill"'
Publikováno v:
Proceedings of the National Academy of Sciences of the United States of America. 119(31)
The lithium supply issue mainly lies in the inability of current mining methods to access lithium sources of dilute concentrations and complex chemistry. Electrochemical intercalation has emerged as a highly selective method for lithium extraction; h
Publikováno v:
Matter. 4:1611-1624
Summary Designing materials with high Li to Na selectivity is the key for direct extraction of Li from unconventional sources, such as seawater, without complex separations. However, material discovery is hindered by an insufficient understanding on
Publikováno v:
Molecular Systems Design & Engineering. 6:25-51
Electrochemical deionization technologies allow generation of potable water from contaminated sources and extraction of valuable resources from seawater, brines and industrial wastewater—all in an environmentally friendly and energy efficient manne
Autor:
Erinn C. Dandley, Gregory N. Parsons, Grant T. Hill, Craig D. Needham, Dennis T. Lee, Philip S. Williams, Christopher J. Oldham
Publikováno v:
The Journal of Physical Chemistry C. 123:16146-16152
The sequential vapor infiltration (SVI) method, based on atomic layer deposition chemistry, allows the creation of a polymer–inorganic hybrid material through the diffusion of metal–organic vapor reagents into a polymer substrate. This study inve
Autor:
James S. Daubert, Jennifer S. Ovental, Philip S. Williams, Hannah N. Gotsch, Christopher J. Oldham, Grant T. Hill, Antoine P. Gremaud, Gregory N. Parsons
Publikováno v:
ACS Applied Materials & Interfaces. 9:4192-4201
Atomic layer deposition (ALD) is a viable means to add corrosion protection to copper metal. Ultrathin films of Al2O3, TiO2, ZnO, HfO2, and ZrO2 were deposited on copper metal using ALD, and their corrosion protection properties were measured using e
Autor:
James S, Daubert, Grant T, Hill, Hannah N, Gotsch, Antoine P, Gremaud, Jennifer S, Ovental, Philip S, Williams, Christopher J, Oldham, Gregory N, Parsons
Publikováno v:
ACS applied materialsinterfaces. 9(4)
Atomic layer deposition (ALD) is a viable means to add corrosion protection to copper metal. Ultrathin films of Al