Fracture mechanics in new designed power module under thermo-mechanical loads

Autor: Durand Camille, Klingler Markus, Coutellier Daniel, Naceur Hakim, Grams Arian, Wittler Olaf

Publikováno v: MATEC Web of Conferences, Vol 12, p 04015 (2014)

Thermo-mechanically induced failure is a major reliability issue in the microelectronic industry. On this account, a new type of Assembly Interconnected Technology used to connect MOSFETs in power modules has been developed. The reliability is increa

Externí odkaz: https://doaj.org/article/7c84663f3cfe4b1da87262eddd9f52d1

Numerical modelling in design for reliability of power modules

Autor: Grams, Arian, Schneider-Ramelow, M., Wittler, O., Wüst, F.

This article deals with today's reliability issues of power modules. It sums up relevant failure modes as well as their causes and explains how numerical modelling can support design processes in different phases of development. As an example, a life

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______610::2b6267e8ab35021ae38bab97cc349b6c
https://publica.fraunhofer.de/handle/publica/242232

Fracture mechanics in new designed power module under thermo‐mechanical loads

Autor: Durand, Camille, Klingler, Markus, Coutellier, Daniel, Naceur, Hakim, Grams, Arian, Wittler, Olaf

Publikováno v: MATEC Web of Conferences
MATEC Web of Conferences, 2014, Paris, France. pp.04015

International audience; Thermo-mechanically induced failure is a major reliability issue in the microelectronic industry. On this account, a new type of Assembly Interconnected Technology used to connect MOSFETs in power modules has been developed. T

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::d26c5845d525bfb7d890b56a43ba00f2
https://hal.archives-ouvertes.fr/hal-01669938

Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law.

Autor: Grams, Arian, Prewitz, Tobias, Wittler, Olaf, Schmitz, Stefan, Middendorf, Andreas, Lang, Klaus-Dieter

Publikováno v: 2014 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2014, p1-6, 6p

Simulation of an aluminum thick wire bond fatigue crack by means of the cohesive zone method.

Autor: Grams, Arian, Prewitz, Tobias, Wittler, Olaf, Kripfgans, Johannes, Schmitz, Stefan, Middendorf, Andreas, Muller, Wolfgang H., Lang, Klaus-Dieter

Publikováno v: 2013 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2013, p1-8, 8p