Copper deposition by electron cyclotron resonance plasma.

Autor: Holber, W. M., Logan, J. S., Grabarz, H. J., Yeh, J. T. C., Caughman, J. B. O., Sugerman, A., Turene, F. E.

Publikováno v: Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; 1993, Vol. 11 Issue 6, p2903-2910, 8p