Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Gowtham Kuntumalla"'
Autor:
Yuquan Meng, Manjunath Rajagopal, Gowtham Kuntumalla, Ricardo Toro, Hanyang Zhao, Ho Chan Chang, Sreenath Sundar, Srinivasa Salapaka, Nenad Miljkovic, Placid Ferreira, Sanjiv Sinha, Chenhui Shao
Publikováno v:
Mathematical Biosciences and Engineering, Vol 17, Iss 6, Pp 7411-7427 (2020)
Ultrasonic metal welding (UMW) is a solid-state joining technique with varied industrial applications. Despite of its numerous advantages, UMW has a relative narrow operating window and is sensitive to variations in process conditions. As such, it is
Externí odkaz:
https://doaj.org/article/dc90e99423684b2e8bb2fe9f8c06bae0
Autor:
Sreenath Sundar, Gowtham Kuntumalla, Nenad Miljkovic, Srinivasa M. Salapaka, Sanjiv Sinha, Longnan Li, Manjunath C. Rajagopal, Hanyang Zhao, Chirag Anand Deshpande, Placid M. Ferreira, Ho Chan Chang, Yuquan Meng, Chenhui Shao, Xiao Yan, Muhammad Jahidul Hoque
Publikováno v:
ACS Applied Materials & Interfaces. 12:12054-12067
Scale formation presents an enormous cost to the global economy. Classical nucleation theory dictates that to reduce the heterogeneous nucleation of scale, the surface should have low surface energy and be as smooth as possible. Past approaches have
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::aa333fb4bc0ebecd1fa2f46c364ee407
https://doi.org/10.1021/acsami.9b22145
https://doi.org/10.1021/acsami.9b22145
Autor:
Srinivasa M. Salapaka, Nenad Miljkovic, Hanyang Zhao, Ho Chan Chang, Gowtham Kuntumalla, Manjunath C. Rajagopal, Yuquan Meng, Ricardo Toro, Chenhui Shao, Placid M. Ferreira, Sreenath Sundar, Sanjiv Sinha
Publikováno v:
Mathematical Biosciences and Engineering, Vol 17, Iss 6, Pp 7411-7427 (2020)
Ultrasonic metal welding (UMW) is a solid-state joining technique with varied industrial applications. Despite of its numerous advantages, UMW has a relative narrow operating window and is sensitive to variations in process conditions. As such, it is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5b0897992820be62419608ce30182b22
https://pubmed.ncbi.nlm.nih.gov/33378903
https://pubmed.ncbi.nlm.nih.gov/33378903
Publikováno v:
The Review of scientific instruments. 91(10)
Heat conduction through bonded metal–polymer interfaces often limits the overall heat transfer in electronic packaging, batteries, and heat recovery systems. To design the thermal circuit in such systems, it is essential to measure the thermal inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::35445743a30c61188989235be3e396ea
https://pubmed.ncbi.nlm.nih.gov/33138563
https://pubmed.ncbi.nlm.nih.gov/33138563
Autor:
Chenhui Shao, Ho Chan Chang, Ricardo Toro, Placid M. Ferreira, Sanjiv Sinha, Hanyang Zhao, Manjunath C. Rajagopal, Gowtham Kuntumalla, Sreenath Sundar, Yuquan Meng, Srinivasa M. Salapaka, Nenad Miljkovic
Publikováno v:
Volume 2B: Advanced Manufacturing.
In the United States, over 50% of the unrecovered energy from industrial processes is in the form of low-grade heat (< 220°C). Materials and maintenance costs of common heat exchangers are typically too high to justify their usage. Polymers, though
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75dd8210e68b0632fb33501718c4a0c3
https://doi.org/10.1115/imece2019-10621
https://doi.org/10.1115/imece2019-10621
Autor:
Sreenath Sundar, Manjunath Chinappamudaliar, Ho Chan Chang, Gowtham Kuntumalla, Yuquan Meng, Hanyang Zhao, Placid Mathew Ferreira, Chenhui Shao, Nenad Miljkovic, Sanjiv Sinha, Srinivasa M Salapaka
Publikováno v:
(International Mechanical Engineering Congress & Exposition, Salt Lake City, Utah, Nov 8-14, 2019).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6229e926e69b50f5bfdc181483ed3af4
https://doi.org/10.2172/1501364
https://doi.org/10.2172/1501364
Autor:
Hanyang Zhao, Srinivasa M. Salapaka, Sreenath Sundar, Yuquan Meng, Nenad Miljkovic, Qasim Nazir, Manjunath C. Rajagopal, Dingyu Peng, Sanjiv Sinha, Gowtham Kuntumalla, Chenhui Shao, Ho Chan Chang, Placid M. Ferreira
Publikováno v:
Volume 2: Processes; Materials.
Joining soft polymers and metals is receiving increasing attention in both industry and academia to enable the manufacturing of innovative products. One motivation arises from the production of next-generation heat exchanges, the structure of which i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d049bb9f9f94defc2507293ca96b05ea
https://doi.org/10.1115/msec2019-2938
https://doi.org/10.1115/msec2019-2938
Autor:
Manjunath C Rajagopal, Yuquan Meng, HoChan Chang, Timothy Man, Gowtham Kuntumalla, Sreenath Sundar, Hanyang Zhao, Srinivasa Salapaka, Chenhui Shao, Placid Ferriera, Nenad Miljkovic, Sanjiv Sinha
Publikováno v:
ASME International Mechanical Engineering Congress & Exposition 2019.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bfac223462be449ccc4917a33da1198
https://doi.org/10.2172/1500208
https://doi.org/10.2172/1500208
Autor:
Hanyang Zhao, Chirag Anand, Ho Chan Chang, Manjunath Rajagopal, Gowtham Kuntumalla, Sreenath Sundar, Yuquan Meng, Chenhui Shao, Placid Ferreira, Srinivasa Salapaka, Sanjiv Sinha, Nenad Miljkovic
Publikováno v:
Micro and Nanoscale Phase Change HeatTransfer, Gordon Research Conference; 2019 Feb 3-8; Lucca (Barga), Italy.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6f5609d0e452b0dd9c798a3717db9e5
https://doi.org/10.2172/1500193
https://doi.org/10.2172/1500193
Autor:
Ho Chan Chang, Manjunath Rajagopal, Hanyang Zhao, Gowtham Kuntumalla, Sreenath Sundar, Yuquan Meng, Chenhui Shao, Placid Ferreira, Srinivasa Salapaka, Sanjiv Sinha, Nenad Miljkovic
Publikováno v:
Proceedings of the Micro and Nanoscale Phase Change Heat Transfer Gordon Research Conference – The Effects of Hydrodynamic, Interfacial and Intermolecular Forces on Phase Change Processes, Lucca, Italy, February 3-8, 2019.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27f5aef464b0517fc91652403b9517dc
https://doi.org/10.2172/1501393
https://doi.org/10.2172/1501393