Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Gopi Neela"'
Autor:
Sreenivas Subramoney, Hong Wang, Belliappa Kuttanna, Eagle Jones, Jim Radford, Gopi Neela, Biji George, Srivatsava Jandhyala, Omer Om J, Dipan Kumar Mandal, Kalsi Gurpreet S, Santhosh Kumar Rethinagiri, Lance Hacking
Publikováno v:
DATE
Visual Inertial Odometry (VIO) is used for estimating pose and trajectory of a system and is a foundational requirement in many emerging applications like AR/VR, autonomous navigation in cars, drones and robots. In this paper, we analyze key compute
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b2e7c25b90e3e4cdb5645df8742f798
https://doi.org/10.23919/date.2019.8714921
https://doi.org/10.23919/date.2019.8714921
Autor:
Gopi Neela, Jeffrey Draper
Publikováno v:
3DIC
Diminishing returns from transistor scaling, increasing interconnect delay, and the need for high device density and high energy efficiency are pushing the semiconductor industry in the direction of 3-dimensional integrated circuits (3DICs). In a 3DI
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ebac817bca3e4232e57ed21f33349413
https://doi.org/10.1109/3dic.2015.7334593
https://doi.org/10.1109/3dic.2015.7334593
Autor:
Gopi Neela, Jeffrey Draper
Publikováno v:
MWSCAS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91df9e0567e6fc3a54c5e698008d1ebe
https://doi.org/10.1109/mwscas.2014.6908344
https://doi.org/10.1109/mwscas.2014.6908344
Modeling the Impact of TSVs on Average Wire Length in 3DICs Using a Tier-Level Hierarchical Approach
Autor:
Jeffrey Draper, Gopi Neela
Publikováno v:
ISVLSI
In a 3-dimensional integrated circuit (3DIC) the active tiers are interconnected using top-metal layer micro-bumps or through-silicon-vias (TSVs). The active area occupied by a TSV is typically several times larger than that of a gate and cannot be i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b7287222f856fc4a02f347d502f6cd1
https://doi.org/10.1109/isvlsi.2014.9
https://doi.org/10.1109/isvlsi.2014.9
Autor:
Jeffrey Draper, Gopi Neela
Publikováno v:
ISCAS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfc598f595715ad45b5472824b22aab6
https://doi.org/10.1109/iscas.2014.6865257
https://doi.org/10.1109/iscas.2014.6865257
Autor:
Jeffrey Draper, Gopi Neela
Publikováno v:
3DIC
Sustaining the trend of integration and energy efficiency, while remaining cost-effective, in the era of slower transistor scaling requires a new solution. Perhaps 3-dimensional integrated circuits (3DIC) are the best current solution to the physical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::541e76e6a32a91594f27ba0dc0681077
https://doi.org/10.1109/3dic.2013.6702384
https://doi.org/10.1109/3dic.2013.6702384
Autor:
Jeffrey Draper, Gopi Neela
Publikováno v:
ACM Great Lakes Symposium on VLSI
Decades of research in optimizing multipliers for power, speed, and area efficiency, and the continuing push for further enhancing multipliers reflects their importance. Energy-efficient computing requires optimization of every single logic component
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94a0855f73f38ef7c2c2905c9964ff1c
https://doi.org/10.1145/2483028.2483107
https://doi.org/10.1145/2483028.2483107
Autor:
Jeffrey Draper, Gopi Neela
Publikováno v:
ISCAS
Diminishing returns from transistor scaling, increasing interconnect delay, and the need for high device density and high energy efficiency are pushing the semiconductor industry in the direction of 3-dimensional integrated circuits (3DICs). A homoge
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b67fb0820ab5164b355849b9151bead
https://doi.org/10.1109/iscas.2013.6571965
https://doi.org/10.1109/iscas.2013.6571965
Autor:
Gopi Neela, Jeffrey Draper
Publikováno v:
MWSCAS
3D chip stacking technology has been gaining traction in recent years, as academia and industry are showing greater interest in going vertical. However, most research so far has been limited to theoretical analysis due to lack of industry-standard CA
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87f18512a3af40ccc07f1b574f266b2d
https://doi.org/10.1109/mwscas.2012.6292061
https://doi.org/10.1109/mwscas.2012.6292061