Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Gonzalo Guelbenzu de Villota"'
Autor:
Teng Li, Gonzalo Guelbenzu de Villota, Ripalta Stabile, Barry Smalbrugge, Chenhui Li, Oded Raz
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology, 8(4), 570-577. IEEE/LEOS
Ultracompact optical submodules for parallel optical interconnects are demonstrated based on a three-level silicon interposer, which is fabricated through a low-cost wet etching process. Using three steps of wet etching of silicon, a multilevel cavit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::191db583040e05416d6141413fb7c57f
https://research.tue.nl/nl/publications/c393d464-fdea-4d6c-bc27-362a9da6b96d
https://research.tue.nl/nl/publications/c393d464-fdea-4d6c-bc27-362a9da6b96d
Publikováno v:
17th International Conference on Transparent Optical Networks, ICTON 2015, 5-9 July 2015, Budapest, Hungary, 1-4
STARTPAGE=1;ENDPAGE=4;TITLE=17th International Conference on Transparent Optical Networks, ICTON 2015, 5-9 July 2015, Budapest, Hungary
STARTPAGE=1;ENDPAGE=4;TITLE=17th International Conference on Transparent Optical Networks, ICTON 2015, 5-9 July 2015, Budapest, Hungary
As the speed and number of interconnects in data centers continues to increase exponentially, architectures for data centers have to be reevaluated to enable the move to Exa-scale computing. A major challenge here is to come up with low cost and low
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e95e21244ab3c864dac94df819dd51aa
https://doi.org/10.1109/icton.2015.7193368
https://doi.org/10.1109/icton.2015.7193368
