Zobrazeno 1 - 10
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pro vyhledávání: '"Gomez, Frederick Ray I."'
Publikováno v:
In Heliyon May 2019 5(5)
Package design is one of the key steps prior fabrication and assembly of semiconductor electronic devices. This paper presents the advantage of securing a robust design architecture for specailized electronic devices to minimize the potential show st
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https://explore.openaire.eu/search/publication?articleId=doi_dedup___::462dd69b4088b84b40ac973526f6d352
In semiconductor assembly manufacturing wherein the competition is tough among all the semiconductor industries, one main factor to consider is the cost of a material. This paper discussed how the product was managed to be competitive in terms of man
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https://explore.openaire.eu/search/publication?articleId=doi_dedup___::237698c2bf007793832c581b1248ca4b
Driven by the direction for smaller devices, the development of thinner version of leadframe become one of the key contributor for miniaturization.
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https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2a75ac2138a3c9d9031bfe3af66ccd09
Miniaturization and densification is the current roadmap of all semiconductor devices. Downsizing or decreasing the size of a semiconductor integrated circuit (IC) as depicted
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https://explore.openaire.eu/search/publication?articleId=doi_dedup___::48886888a453beaaaac16dbac401d63d
Today more than ever, cost reductions push the industry towards larger strip formats and thin substrate in manufacturing for efficiencies at high-cost processes
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https://explore.openaire.eu/search/publication?articleId=doi_dedup___::419bb65c6a963b8956e5a5a2ac474ccc
A ball grid array or BGA semiconductor device is a type of surface mount packaging used in integrated circuit (IC) with the silicon die wired/connected to the bond fingers and metallic inter-layers of the substrate.
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https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9889c48b23716cb2bd0c3a6cd530f7a0
This active balun is comprised of 2 amplifiers namely common-gate (CG) amplifier (M1) in the 1st stage and common-source (CS) amplifier (M2) in the 2nd stage
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https://explore.openaire.eu/search/publication?articleId=doi_dedup___::32d21d6a40f090c6118fe26f855e4210
A balun (balanced-unbalanced) circuit converts signals that are single-ended or unbalanced with respect to ground into signals that are differential or balanced with respect to ground, and/or vice versa. An ideal balun generates a pair of differentia
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https://explore.openaire.eu/search/publication?articleId=doi_dedup___::32d9e32dcd56613407b92c647246cdc3
Autor:
Gomez, Frederick Ray I.
The differential active balun shown in Fig. 1 is composed of 3 transistors namely M1 and M2 for the differential output, and M3 for the tail current.
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https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9d8721fe324a7b395752f1e8c3d01e76