Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Golzar Alavi"'
Autor:
Joachim N. Burghartz, Golzar Alavi, Bjorn Albrecht, Thomas Deuble, Mourad Elsobky, Saleh Ferwana, Christine Harendt, Yigit Mahsereci, Harald Richter, Zili Yu
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 7, Pp 776-783 (2019)
This paper reports on the status of a comprehensive ten-year research and development effort toward hybrid system-in-foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electro
Externí odkaz:
https://doaj.org/article/bb64a3b25bfb4cc39bd5683382dd2bc9
Autor:
Mourad Elsobky, Golzar Alavi, Björn Albrecht, Thomas Deuble, Christine Harendt, Harald Richter, Zili Yu, Joachim N. Burghartz
Publikováno v:
Proceedings, Vol 2, Iss 13, p 748 (2018)
Hybrid System-in-Foil exploits the complementary benefits of integrating embedded silicon chips with on-foil passive and active electronic components. In this work, the design, fabrication and characterization of three on-foil components, namely a hu
Externí odkaz:
https://doaj.org/article/3931a53734d343038176875db66f0c34
Autor:
Manfred Berroth, Mahsa Rasteh, Markus Grozing, Golzar Alavi, Joachim N. Burghartz, Jan Hesselbarth, Sefa Ozbek
Publikováno v:
International Journal of Microwave and Wireless Technologies. 11:864-871
A flexible and adaptive energy-efficient high-speed wireless hub is developed in polymer foil as a Hybrid System-in-Foil (HySiF) using Chip-Film Patch (CFP) technology. In this matter, the SiGe BiCMOS silicon chips (2.39 × 1.65 mm2) are thinned down
Autor:
Saleh Ferwana, Harald Richter, Zili Yu, Christine Harendt, Bjorn Albrecht, Golzar Alavi, Yigit Mahsereci, Joachim N. Burghartz, Thomas Deuble, Mourad Elsobky
Publikováno v:
IEEE Journal of the Electron Devices Society. 7:776-783
This paper reports on the status of a comprehensive ten-year research and development effort toward hybrid system-in-foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electro
Autor:
Johannes Digel, Golzar Alavi, Joachim N. Burghartz, Manfred Berroth, Sefa Ozbek, Markus Grozing
Publikováno v:
Integration. 63:291-298
This paper reports a transformer-based integrated class-A Differential Power Amplifier (DPA) for the Internet of Things (IoT) applications. The proposed 5–6 GHz fully integrated differential PA is fabricated in a cost-effective 95 GHz-fmax, 0.25 μ
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:802-810
In this paper, a unique adaptive layout methodology for accurate interconnection between two or more functional chips at the wafer level is presented. The methodology is based on an automatic layout modification for each embedded chip with considerin
Autor:
Michael Strecker, Harald Richter, Mohamed Elattar, Mourad Elsobky, Ute Zschieschang, Golzar Alavi, Hagen Klauk, Joachim N. Burghartz, Florian Letzkus
Publikováno v:
Organic Electronics. 50:491-498
This paper presents the design, fabrication and characterization of digital logic gates, flip-flops and shift registers based on low-voltage organic thin-film transistors (TFTs) on flexible plastic substrates. The organic transistors are based on the
Autor:
Thomas Deuble, Bjorn Albrecht, Zili Yu, Christine Harendt, Mourad Elsobky, Harald Richter, Joachim N. Burghartz, Golzar Alavi
Publikováno v:
Proceedings, Vol 2, Iss 13, p 748 (2018)
Hybrid System-in-Foil exploits the complementary benefits of integrating embedded silicon chips with on-foil passive and active electronic components. In this work, the design, fabrication and characterization of three on-foil components, namely a hu
Publikováno v:
2018 48th European Microwave Conference (EuMC).
This paper reports on a design methodology and measurement results of a fully integrated low noise amplifier (LNA) on a thinned substrate for Internet of Things (IoT) applications. Several key RF performance parameters of the LNA with different subst
Autor:
Golzar Alavi, Manfred Berroth, Mahsa Rasteh, Joachim N. Burghartz, Markus Grozing, Jan Hesselbarth, Sefa Ozbek
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
a flexible and adaptive energy-efficient high-speed wireless hub is developed as a Hybrid System-in-Foil (HySiF) using CMOS compatible Chip-Film Patch (CFP) technology. In this matter, the SiGe BiCMOS silicon chips (2.39 × 1.65 mm2) are thinned down